Multi-axial Elastic Averaging for Sub-Micron Passive Alignment of Photonic Components
Goh, Simon Chun Kiat, Siah, Chun Fei, Xu, Baochang, Zhang, Yu, Pam, Mei Er, Guevarra, Enrico, Goh, Edwin Sze Ping, Wang, Lin, Pile, Brian, Carlan, Arbiz, Lee, James Yong Meng, Venkatesan, Suresh, Lim, Yeow Kheng, Thean, Aaron Voon-Yew
Published in Journal of lightwave technology (15.06.2023)
Published in Journal of lightwave technology (15.06.2023)
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Blanket SMT With In Situ N2 Plasma Treatment on the (100) Wafer for the Low-Cost Low-Power Technology Application
JUN YUAN, CHAN, Victor, BELYANSKY, Michael P, ELLER, Manfred, YONG MENG LEE, CAVE, Nigel, HUILING SHANG, YING LI, DIVAKARUNI, Rama, ROVEDO, Nivo, SARDESAI, Viraj, KANIKE, Narasimhulu, VARADARAJAN, Vidya, YU, Mickey, JONG HO YANG, JEONG, Y. K, SUNG KWON, O
Published in IEEE electron device letters (01.09.2009)
Published in IEEE electron device letters (01.09.2009)
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Journal Article
Blanket SMT With In Situ N2 Plasma Treatment on the \langle \hbox \rangle Wafer for the Low-Cost Low-Power Technology Application
Jun Yuan, Chan, V., Rovedo, N., Sardesai, V., Kanike, N., Varadarajan, V., Yu, M., Jong Ho Yang, Jeong, Y.K., Kwon, O.S., Belyansky, M.P., Eller, M., Yong Meng Lee, Cave, N., Huiling Shang, Ying Li, Divakaruni, R.
Published in IEEE electron device letters (01.09.2009)
Published in IEEE electron device letters (01.09.2009)
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Journal Article
Blanket SMT With In Situ N2 Plasma Treatment on the langle hbox 100 rangle Wafer for the Low-Cost Low-Power Technology Application
Yuan, Jun, Chan, V, Rovedo, N, Sardesai, V, Kanike, N, Varadarajan, V, Yu, M, Ho Yang, Jong, Jeong, Y K, Kwon, O S, Belyansky, M P, Eller, M, Meng Lee, Yong, Cave, N, Shang, Huiling, Li, Ying, Divakaruni, R
Published in IEEE electron device letters (01.01.2009)
Published in IEEE electron device letters (01.01.2009)
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Journal Article
CURRENT SOURCE AND DIGITAL TO ANALOG CONVERTOR
YANG, Cheng-Jui, LEE, Yong Meng, YU, Shaofeng, ZHAO, Hai, LIU, Yang, MAO, Gang
Year of Publication 30.05.2018
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Year of Publication 30.05.2018
Patent
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
YANG, Cheng-Jui, LEE, Yong Meng, YU, Shaofeng, ZHAO, Hai, LIU, Yang, MAO, Gang
Year of Publication 18.04.2018
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Year of Publication 18.04.2018
Patent
Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer
Goh, Simon Chun Kiat, Xu, Baochang, Zhang, Yu, Siah, Chun Fei, Zhao, Bo, Sebastian, Rappl, Lee, James Yong Meng, Venkatesan, Suresh, Thean, Aaron Voon Yew, Lim, Yeow Kheng
Published in 2022 European Conference on Optical Communication (ECOC) (18.09.2022)
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Published in 2022 European Conference on Optical Communication (ECOC) (18.09.2022)
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