Testing to eliminate reliability defects from electronic packages
Memis, I.
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
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Conference Proceeding
ATTACHING HEAT SINKS DIRECTLY TO FLIP CHIPS AND CERAMIC CHIP CARRIERS
GAYNES, MICHAEL ANTHONY, MEMIS, IRVING, BERNIER, WILLIAM EMMETT, SHAUKATULLAH, HUSSAIN
Year of Publication 16.10.2000
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Year of Publication 16.10.2000
Patent