Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures
SHAW THOMAS M, HANNON ROBERT, LANE MICHAEL W, LIU XIAO HU, FAROOQ MUKTA G, MELVILLE IAN D. W
Year of Publication 13.12.2011
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Year of Publication 13.12.2011
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INHIBITING DAMAGE FROM DICING AND CHIP PACKAGING INTERACTION FAILURES IN BACK END OF LINE STRUCTURES
SHAW THOMAS M, HANNON ROBERT, LANE MICHAEL W, LIU XIAO HU, FAROOQ MUKTA G, MELVILLE IAN D. W
Year of Publication 13.11.2008
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Year of Publication 13.11.2008
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Inhibiting ic device damage from dicing and beol processing
SHAW THOMAS M, HANNON ROBERT, LANE MICHAEL W, LIU XIAO HU, FAROOQ MUKTA G, MELVILLE IAN D. W
Year of Publication 18.07.2012
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Year of Publication 18.07.2012
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Inhibiting ic device damage from dicing and beol processing
SHAW THOMAS M, HANNON ROBERT, LANE MICHAEL W, LIU XIAO HU, FAROOQ MUKTA G, MELVILLE IAN D. W
Year of Publication 24.03.2010
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Year of Publication 24.03.2010
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