Copper wire bond pad/IMC interfacial layer crack study during HTSL (high temperature storage life) test
Mingchuan Han, Miao Wang, Lidong Zhang, Beiyue Yan, Jun Li, Meijiang Song, Mathew, Varughese
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Study of Cu wire bonding on NiPdAu pad of fine pitch low k C55nm technology for high temperature automotive application
Liuchang Hu, Xuesong Xu, Jinzhong Yao, Meijiang Song, Mingchuan Han
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
Study of optimum bond pad metallization thickness for copper wire bond process
Meijiang Song, Gong, G L, Yao, J Z, Sean Xu, Lee, S, Han, M C, Yan, B Y
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Failure Mechanism and Solution Study of IC Wire Bond Heel Crack on Leadframe
Meijiang Song, Jinzhong Yao, Yongsheng Lu
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
A New Finding of Cu-Al IMC Corrosion and Investigation of Fluorine Contamination Influence on Cu-Al IMC Corrosion
Song, Meijiang, Mathew, Varughese, Li, Leo, Wang, Sonder, Han, M. C., Song, Yu, Descartin, Allen M.
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
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Conference Proceeding
LEAD FRAME WITH SELECTIVE PATTERNED PLATING
Descartin, Allen Marfil, Zhang, Lidong, Ching, JR., Mariano Layson, Song, Meijiang, Li, Jun
Year of Publication 25.06.2020
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Year of Publication 25.06.2020
Patent
Non-continuous IMC in copper wirebonding: Key factor affecting the reliability
Descartin, Allen M., Song, MeiJiang, Li, Jun, Yan, BeiYue
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
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Conference Proceeding
Lead frame with selective pattern plating
MARIANO LAYSON CHING JR, LI JUN, ZHANG LIDON, ALLEN MARFIL DESCARTIN, SONG MEIJIANG
Year of Publication 26.06.2020
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Year of Publication 26.06.2020
Patent
Copper ball bond interface structure and formation
SIONG CHIN TECK, ZAPICO MATTHEW J, ARTHUR JOHN G, TRAN TU-ANH N, LEE CHUUNG, YAP JIA LIN, AU YIN KHENG, SONG MEIJIANG
Year of Publication 09.02.2016
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Year of Publication 09.02.2016
Patent
Copper Ball Bond Interface Structure And Formation
TU-ANH N. TRAN, MEIJIANG SONG, YIN KHENG AU, JOHN G. ARTHUR, MATTHEW J. ZAPICO, CHIN TECK SIONG, JIA LIN YAP, CHUUNG LEE
Year of Publication 03.06.2015
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Year of Publication 03.06.2015
Patent
Copper Ball Bond Interface Structure and Formation
SIONG CHIN TECK, ZAPICO MATTHEW J, ARTHUR JOHN G, TRAN TU-ANH N, LEE CHUUNG, YAP JIA LIN, AU YIN KHENG, SONG MEIJIANG
Year of Publication 28.05.2015
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Year of Publication 28.05.2015
Patent
Copper ball bond interface structure and formation
TRAN, TU-ANH N, ARTHUR, JOHN G, SONG, MEIJIANG, ZAPICO, MATTHEW J, YAP, JIA LIN, LEE, CHUUNG, AU, YIN KHENG, SIONG, CHIN TECK
Year of Publication 11.09.2018
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Year of Publication 11.09.2018
Patent