Protruding SN substrate features for epoxy flow control
Haehn, Nicholas S, Mehta, Vipul, Singh, Antariksh Rao Pratap, Vehonsky, Jacob, Jain, Rahul, Cetegen, Edvin, Cho, Steve S, Heaton, Thomas, Chan Arguedas, Sergio, Ibrahim, Tarek, Neal, Nicholas
Year of Publication 11.06.2024
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Year of Publication 11.06.2024
Patent
Barrier structures for underfill containment
Mehta, Vipul, Guo, Yang, Okafor, Ifeanyi, Cetegen, Edvin, Zhong, Shan, Choudhury, Soud, Brun, Xavier, Wang, Hsin-Wei, Liu, Nai-Yuan, Rumer, Christopher, Li, Wei, Lin, Ziyin
Year of Publication 04.06.2024
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Year of Publication 04.06.2024
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BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING
PATEL, Jigneshkumar, DUAN, Gang, BRUN, Xavier, MEHTA, Vipul, YERRAMILLI, Aditya Sumanth, RAMALINGAM, Suriyakala, LIN, Ziyin, XU, Dingying, CROISSANT, Jonas
Year of Publication 09.05.2024
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Year of Publication 09.05.2024
Patent
HYDROPHOBIC BARRIERS TO CONTROL FLOW OF ADHESIVE IN A SEMICONDUCTOR PACKAGE
ZIADEH, Bassam, MEHTA, Vipul, HUANG, Jingyi, LIN, Ziyin, BAI, Yiqun, VAN NAUSDLE, Joseph
Year of Publication 29.06.2022
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Year of Publication 29.06.2022
Patent
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
ZIADEH, Bassam, MEHTA, Vipul, HUANG, Jingyi, LIN, Ziyin, BAI, Yiqun, VAN NAUSDLE, Joseph
Year of Publication 23.06.2022
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Year of Publication 23.06.2022
Patent
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
ALUR, Siddharth K, VADLAMANI, Sai, DHALL, Ashish, CHAVALI, Sri Chaitra J, LEE, Kyu Oh, JAIN, Rahul, JEN, Wei-Lun K, MEHTA, Vipul V, MANEPALLI, Rahul N, ALUR, Amruthavalli P
Year of Publication 06.06.2024
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Year of Publication 06.06.2024
Patent
Package with underfill containment barrier
Mehta, Vipul V, Dhall, Ashish, Lee, Kyu Oh, Jain, Rahul, Jen, Wei-Lun K, Chavali, Sri Chaitra J, Alur, Siddharth K, Vadlamani, Sai, Alur, Amruthavalli P, Manepalli, Rahul N
Year of Publication 19.03.2024
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Year of Publication 19.03.2024
Patent
New generation tools for multiphase reaction systems: A validated systematic methodology for novelty and design automation
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Journal Article
Conference Proceeding
SEMICONDUCTOR PACKAGE HAVING WAFER-LEVEL ACTIVE DIE AND EXTERNAL DIE MOUNT
MALLIK, Debendra, LI, Eric Jin, GANESAN, Sanka, MEHTA, Vipul Vijay, SANKMAN, Robert Leon
Year of Publication 18.03.2021
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Year of Publication 18.03.2021
Patent
Semiconductor package having wafer-level active die and external die mount
Sankman, Robert Leon, Mehta, Vipul Vijay, Ganesan, Sanka, Mallik, Debendra, Li, Eric Jin
Year of Publication 02.02.2021
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Year of Publication 02.02.2021
Patent
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
ALUR, Siddharth K, VADLAMANI, Sai, DHALL, Ashish, CHAVALI, Sri Chaitra J, LEE, Kyu Oh, JAIN, Rahul, JEN, Wei-Lun K, MEHTA, Vipul V, MANEPALLI, Rahul N, ALUR, Amruthavalli P
Year of Publication 03.08.2023
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Year of Publication 03.08.2023
Patent
Package with underfill containment barrier
Mehta, Vipul V, Dhall, Ashish, Lee, Kyu Oh, Jain, Rahul, Jen, Wei-Lun K, Chavali, Sri Chaitra J, Alur, Siddharth K, Vadlamani, Sai, Alur, Amruthavalli P, Manepalli, Rahul N
Year of Publication 30.05.2023
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Year of Publication 30.05.2023
Patent