Comparative Study of Dose Volume Parameters in 2-Dimensional Radiography and 3-Dimensional Computed Tomography Based High Dose Rate Intracavitary Brachytherapy in Cervical Cancer: A Prospective Study
Mehta, Vipul, Gupta, Parul, Gothwal, Ravinder Singh, Dana, Rohitashwa, Gupta, Narendra, Gupta, Shivani
Published in Asian Pacific journal of cancer care (04.09.2022)
Published in Asian Pacific journal of cancer care (04.09.2022)
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Journal Article
Controlling Underfill on Die in Multichip Heterogenous Integration With Large Die Height Delta
Lin, Ziyin, Li, Wei, Cetegen, Edvin, Guo, Yang, Liu, Nai-Yuan, Okafor, Ifeanyi, Mehta, Vipul, Brun, Xavier, Zhong, Shan, Li, Hsin-Yu, Rumer, Christopher
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2023)
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Journal Article
웨이퍼-레벨 액티브 다이 및 외부 다이 마운트를 갖는 반도체 패키지
GANESAN SANKA, MEHTA VIPUL VIJAY, MALLIK DEBENDRA, SANKMAN ROBERT LEON, LI ERIC JIN
Year of Publication 07.08.2019
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Year of Publication 07.08.2019
Patent
Solutions to Overcome Warpage and Voiding Challenges in Fanout Wafer-level Packaging
Jayaram, Vidya, Mehta, Vipul, Bai, Yiqun, Decker, John C
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Integrating collaborative planning and supply chain optimization for the chemical process industry (I)—methodology
Berning, Guido, Brandenburg, Marcus, Gürsoy, Korhan, Kussi, Jürgen S., Mehta, Vipul, Tölle, Franz-Josef
Published in Computers & chemical engineering (15.06.2004)
Published in Computers & chemical engineering (15.06.2004)
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Journal Article
An integrated system solution for supply chain optimization in the chemical process industry
Berning, Guido, Brandenburg, Marcus, Gürsoy, Korhan, Mehta, Vipul, Tölle, Franz-Josef
Published in OR Spectrum (01.11.2002)
Published in OR Spectrum (01.11.2002)
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Journal Article
Semiconductor package having wafer-level active die and external die mount
Sankman, Robert Leon, Mehta, Vipul Vijay, Ganesan, Sanka, Mallik, Debendra, Li, Eric Jin
Year of Publication 03.01.2023
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Year of Publication 03.01.2023
Patent
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
HAEHN, Nicholas S, HEATON, Thomas, CETEGEN, Edvin, CHAN ARGUEDAS, Sergio, JAIN, Rahul, MEHTA, Vipul, CHO, Steve S, SINGH, Antariksh Rao Pratap, VEHONSKY, Jacob, IBRAHIM, Tarek, NEAL, Nicholas
Year of Publication 01.08.2024
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Year of Publication 01.08.2024
Patent