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"MCLELLAN, NEIL R"
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"MCLELLAN, NEIL R"
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DELAYED REFLOW ALLOY MIX SOLDER PASTE
by
MCLELLAN
,
NEIL R
Year of Publication
21.03.1996
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FLIP CHIP SEMICONDUCTOR PACKAGE WITH ENCAPSULANT RETAINING STRUCTURE AND STRIP
by
TOPACIO, Roden, R
,
MCLELLAN
,
Neil
,
R
,
CHAN, Vincent, K
Year of Publication
20.12.2017
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Integrated circuit package strip with stiffener
by
TOPACIO, III RODEN R
,
CHAN VINCENT K
,
MCLELLAN NEIL R
Year of Publication
30.09.2014
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INTEGRATED PACKAGE CIRCUIT WITH STIFFENER
by
TOPACIO RODEN R
,
CHAN VINCENT K
,
MCLELLAN NEIL R
Year of Publication
24.05.2012
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FLIP CHIP SEMICONDUCTOR PACKAGE WITH ENCAPSULANT RETAINING STRUCTURE AND STRIP
by
CHAN, VINCENT, K
,
MCLELLAN
,
NEIL
,
R
,
TOPACIO, RODEN, R
Year of Publication
29.02.2012
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Integrated package circuit with stiffener
by
McLellan
,
Neil R
,
Chan, Vincent K
,
Topacio, Roden R
Year of Publication
21.02.2012
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Integrated package circuit with stiffener
by
TOPACIO RODEN R
,
CHAN VINCENT K
,
MCLELLAN NEIL R
Year of Publication
21.02.2012
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Circuit board component shim structure
by
HU SUMING
,
MARTINEZ LIANE
,
LOW YIP SENG
,
MCLELLAN NEIL R
Year of Publication
22.10.2013
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FLIP CHIP SEMICONDUCTOR PACKAGE WITH ENCAPSULANT RETAINING STRUCTURE AND STRIP
by
CHAN, VINCENT, K
,
MCLELLAN
,
NEIL
,
R
,
TOPACIO, RODEN, R
Year of Publication
03.03.2011
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CIRCUIT BOARD COMPONENT SHIM STRUCTURE
by
HU SUMING
,
MARTINEZ LIANE
,
LOW YIP SENG
,
MCLELLAN NEIL R
Year of Publication
13.06.2013
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FLIP CHIP SEMICONDUCTOR PACKAGE WITH ENCAPSULANT RETAINING STRUCTURE AND STRIP
by
CHAN, VINCENT, K
,
MCLELLAN
,
NEIL
,
R
,
TOPACIO, RODEN, R
Year of Publication
05.08.2009
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FLIP CHIP SEMICONDUCTOR PACKAGE WITH ENCAPSULANT RETAINING STRUCTURE AND STRIP
by
TOPACIO RODEN R
,
CHAN VINCENT K
,
MCLELLAN NEIL R
Year of Publication
11.06.2009
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Flexible film semiconductor package
by
MCLELLAN
,
NEIL R
Year of Publication
17.07.1996
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Flip-Chip Grid Ball Array Strip and Package
by
TOPACIO RODEN R
,
CHAN VINCENT K
,
MCLELLAN NEIL R
Year of Publication
21.08.2008
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FLIP CHIP SEMICONDUCTOR PACKAGE WITH ENCAPSULANT RETAINING STRUCTURE AND STRIP
by
CHAN, VINCENT, K
,
MCLELLAN
,
NEIL
,
R
,
TOPACIO, RODEN, R
Year of Publication
06.03.2008
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Flip-Chip Ball Grid Array Strip and Package
by
TOPACIO RODEN R
,
CHAN VINCENT K
,
MCLELLAN NEIL R
Year of Publication
06.03.2008
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Flexible film semiconductor package
by
MCLELLAN
,
NEIL R
Year of Publication
09.09.1992
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FLEXIBLE FILM SEMICONDUCTOR PACKAGE
by
MCLELLAN
;
NEIL R
Year of Publication
14.07.1992
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Delayed reflow alloy mix solder paste
by
MCLELLAN
;
NEIL R
Year of Publication
01.05.1990
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Delayed reflow alloy mix solder paste
by
MCLELLAN
;
NEIL R
Year of Publication
12.09.1989
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