Microstructure Development in Powder Bed Additive Manufacturing
Porter, John, Velez, Michael, Hayes, Brian, McCrabb, Heather, Hall, Tim
Published in Microscopy and microanalysis (01.07.2016)
Published in Microscopy and microanalysis (01.07.2016)
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Journal Article
ElectroConcentration and ElectroFlotation for Dewatering/Water Purification
Inman, Maria E., Taylor, E. J., McCrabb, Heather, Skinn, Brian, Kell, Joseph, Stuart, Ben
Published in ECS transactions (02.04.2013)
Published in ECS transactions (02.04.2013)
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Journal Article
Sustainable Electrochemical Machining for Metal Recovery, Elimination of Waste, and Minimization of Water Usage
Skinn, Brian, Lucatero, Savidra, Snyder, Stephen, Taylor, E. J, Hall, Timothy D, McCrabb, Heather, Garich, Holly, Inman, Maria E.
Published in ECS transactions (29.07.2016)
Published in ECS transactions (29.07.2016)
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Journal Article
Electrodeposition Of CoMn Onto Stainless Steels Interconnects For Increased Lifetimes In SOFCs
Hall, Timothy D., McCrabb, Heather, Wu, Junwei, Zhang, Hui, Liu, Xingbo, Taylor, Jennings
Published in ECS transactions (01.01.2011)
Published in ECS transactions (01.01.2011)
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Journal Article
Through Mask Electrochemical Machining
McCrabb, Heather, Lozano-Morales, Alonso, Snyder, Stephen, Gebhart, Larry, Taylor, E. Jennings
Published in ECS transactions (02.10.2009)
Published in ECS transactions (02.10.2009)
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Journal Article
Electrodeposition of Cobalt-Manganese Alloy Coatings onto Metallic SOFC Interconnects
McCrabb, Heather, Lucatero, Savidra, Hall, Tim D, Snyder, Stephen, Kagajwala, Burhanuddin, Zhang, Hui, Liu, Xingbo, Taylor, E. J.
Published in ECS transactions (01.01.2013)
Published in ECS transactions (01.01.2013)
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Journal Article
Pulsed Electric Fields for Fabrication of Copper/Carbon Nanotube and Carbon Nanotube Films
McCrabb, Heather, Taylor, E. J., Inman, Maria, Devlin, Christie, Leines, Matthew
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article
Electrodeposition of CoMn onto Stainless Steels Interconnects for Increased Lifetimes in SOFCs
Hall, Timothy, McCrabb, Heather, Wu, Junwei, Zhang, Hui, Liu, Xingbo, Taylor, E. J.
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article
Controlling Whisker Formation in Tin-Based Solders Using Electrically Mediated Electrodeposition
Garich, Holly, McCrabb, Heather, Taylor, E. Jennings, Inman, Maria
Published in ECS transactions (28.09.2007)
Published in ECS transactions (28.09.2007)
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Journal Article
Development and Characterization of Plating Cell Geometry for PCB and Packaging Applications
Garich, Holly, Gebhart, Larry, Taylor, E. Jennings, Inman, Maria, McCrabb, Heather
Published in ECS transactions (06.07.2007)
Published in ECS transactions (06.07.2007)
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Journal Article
Sequenced pulse reverse waveform surface finishing of additively manufactured parts
McCrabb, Heather, Hall, Timothy D, Taylor, Earl Jennings, Garich, Holly M
Year of Publication 18.07.2023
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Year of Publication 18.07.2023
Patent
Electrochemical finishing of small part components
Lozano-Morales, Alonso, McCrabb, Heather, Miller, Phillip, Inman, Maria, Taylor, E. Jennings
Published in Metal finishing (2008)
Published in Metal finishing (2008)
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Journal Article
Simulation and Experimental Results for Copper Deposition in a Moving Wafer Tool to Minimize Terminal Effects
McCrabb, Heather, Lee, Jong-Min, Taylor, E.J., Carpio, Ron
Published in ECS transactions (07.02.2007)
Published in ECS transactions (07.02.2007)
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Journal Article
Determination of Diffusion Boundary Layers and Copper Thickness Uniformity in Plating Tools Designed for 3-D Interconnect and Packaging Applications
McCrabb, Heather, Garich, Holly, Gebhart, Larry, Inman, Maria, Taylor, E. Jennings, Carpio, Ron
Published in ECS transactions (28.09.2007)
Published in ECS transactions (28.09.2007)
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Journal Article
SEQUENCED PULSE REVERSE WAVEFORM SURFACE FINISHING OF ADDITIVELY MANUFACTURED PARTS
McCrabb, Heather, Hall, Timothy D, Taylor, Earl Jennings, Garich, Holly M
Year of Publication 06.01.2022
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Year of Publication 06.01.2022
Patent