Array Packaging with Integrated Mirrors for High Power Multi-Chip UVC-LED Modules
Hansen, Ulli, Hu, Xiaodong, Maus, Simon, Gyenge, Oliver
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11.09.2024)
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11.09.2024)
Get full text
Conference Proceeding
Low temperature glass-thin-films for use in power applications
Leib, J., Gyenge, O., Hansen, U., Maus, S., Hauck, K., Ndip, I., Toepper, M.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Get full text
Conference Proceeding