Search Results - "MATZ LAURA M" :: K.UTB vyhledávací portál

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SiC Film for Semiconductor Processing

by TSUI TING, DOSTALIK WILLIAM WESLEY, JIANG PING, MATZ LAURA M
Year of Publication 26.03.2009

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Silicon Carbide Doped Oxide Hardmask For Single and Dual Damascene Integration

by DOSTALIK WILLIAM WESLEY, JIANG PING N, MATZ LAURA M
Year of Publication 19.03.2009

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DIELECTRIC BARRIER DEPOSITION USING OXYGEN CONTAINING PRECURSOR

by O'NEILL, MARK, LEONARD, SINATORE, DINO, VRTIS, RAYMOND, NICHOLAS, MATZ, LAURA, M
Year of Publication 19.10.2011

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PLASMA TREATMENT AND REPAIR PROCESSES FOR REDUCING SIDEWALL DAMAGE IN LOW-K DIELECTRICS

by JIANG PING, OROZCO-TERAN ROSA A, MATZ LAURA M
Year of Publication 15.01.2009

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AUSGANGSVERBINDUNGEN ZUR ABSCHEIDUNG VON SCHICHTEN, DIE GRUPPE-4-METALLE ENTHALTEN

by MATZ, LAURA M, BUCHANAN, IAIN, SPENCE, DANIEL P, KIM, MOO-SUNG, IVANOV, SERGEI VLADIMIROVICH, LEI, XINJIAN
Year of Publication 15.09.2011

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LIQUID COMPOSITION CONTAINING AMINOETHER FOR DEPOSITION OF METAL-CONTAINING FILMS

by NORMAN JOHN ANTHONY THOMAS, IVANOV SERGEI VLADIMIROVICH, SPENCE DANIEL P, LEI XINJIAN, MATZ LAURA M
Year of Publication 01.09.2011

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Precursors for depositing group 4 metal-containing films

by MATZ, LAURA M, BUCHANAN, IAIN, SPENCE, DANIEL P, KIM, MOO-SUNG, IVANOV, SERGEI VLADIMIROVICH, LEI, XINJIAN
Year of Publication 24.08.2011

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Hydrogen and oxygen based photoresist removal process

by Smith, Patricia Beauregard, Matz, Laura M, Shah, Vinay
Year of Publication 19.08.2008

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Hydrogen and oxygen based photoresist removal process

by SHAH VINAY, SMITH PATRICIA BEAUREGARD, MATZ LAURA M
Year of Publication 19.08.2008

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LIQUID COMPOSITION CONTAINING AMINOETHER FOR DEVELOPING METAL-CONTAINING FILM

by NORMAN JOHN A T, IVANOV SERGEI VLADIMIROVICH, SPENCE DANIEL P, LEI XINJIAN, MATZ LAURA M
Year of Publication 21.04.2011

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Improved adhesion to copper and copper electromigration resistance

by VRTIS, RAYMOND NICHOLAS, MATZ, LAURA M, O'NEILL, MARK LEONARD
Year of Publication 01.04.2015

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Chemical Mechanical Planarization (CMP) composition and methods therefore for copper and Through Silicon Via (TSV) applications

by MATZ, LAURA M, TSAI, MING-SHIH, PAN, PAO CHIA, LI, CHRIS KEH-YEUAN, YANG, RUNG-JE, LEW, BLAKE J, SHI, XIAOBO, HSIEH, CHAD CHANG-TSE, DERECSKEI-KOVACS, AGNES, O'NEILL, MARK LEONARD
Year of Publication 16.01.2020

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DIELECTRIC BARRIER DEPOSITION USING NITROGEN CONTAINING PRECURSOR

by XIAO MANCHAO, MALLIKARJUNAN ANUPAMA, O'NEILL MARK LEONARD, VRTIS RAYMOND NICHOLAS, MATZ LAURA M, JOHNSON ANDREW DAVID
Year of Publication 25.11.2010

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Dielectric Barrier Deposition Using Nitrogen Containing Precursor

by XIAO MANCHAO, MALLIKARJUNAN ANUPAMA, O'NEILL MARK LEONARD, VRTIS RAYMOND NICHOLAS, MATZ LAURA M, JOHNSON ANDREW DAVID
Year of Publication 18.11.2010

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Dielectric barrier deposition using nitrogen containing precursor

by Matz, Laura M, Xiao, Manchao, O'Neill, Mark Leonard, Mallikarjunan, Anupama, Vrtis, Raymond Nicholas, Johnson, Andrew David
Year of Publication 17.11.2010

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Chemical mechanical planarization (cmp) composition and methods therefore for copper and through silicon via (tsv) applications

by MATZ, LAURA M, TSAI, MING-SHIH, PAN, PAO CHIA, LI, CHRIS KEH-YEUAN, YANG, RUNG-JIE, LEW, BLAKE J, SHI, XIAOBO, HSIEH, CHAD CHANG-TSE, DERECSKEI-KOVACS, AGNES, O'NEILL, MARK LEONARD
Year of Publication 01.12.2019

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