Polishing method and polishing apparatus
OKANO; HARUO, MATSUO; MIE, NAKATA; REMPEI, YANO; HIROYUKI, WADA; JUNICHI, HAYASAKA; NOBUO, SASAKI; YASUTAKA
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Year of Publication 07.07.1998
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Semiconductor device having a metal film formed in a groove in an insulating film
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Year of Publication 24.03.1998
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Year of Publication 24.03.1998
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Polishing method and polishing apparatus
OKANO; HARUO, MATSUO; MIE, NAKATA; REMPEI, YANO; HIROYUKI, WADA; JUNICHI, HAYASAKA; NOBUO, SASAKI; YASUTAKA
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Year of Publication 04.03.1997
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Method for forming an electrode and/or wiring layer by reducing copper oxide or silver oxide
OKANO; HARUO, WADA; JUN-ICHI, MIYAJIMA; HIDESHI, MATSUO; MIE, HAYASAKA; NOBUO, SUGURO; KYOICHI
Year of Publication 01.10.1996
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Year of Publication 01.10.1996
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Method of manufacturing semiconductor metal wiring layer by reduction of metal oxide
OKANO; HARUO, WADA; JUN-ICHI, MIYAJIMA; HIDESHI, MATSUO; MIE, HAYASAKA; NOBUO, SUGURO; KYOICHI
Year of Publication 13.06.1995
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Year of Publication 13.06.1995
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Semiconductor device and manufacturing method thereof
HARADA SUSUMU, MATSUO MIE, OMURA ICHIRO, TAKAHASHI KENJI, AOKI HIDEO, EZAWA HIROKAZU, IKENOUE HIROSHI, NUMATA HIDEO, TAKUBO CHIAKI, KANEKO HISASHI
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Year of Publication 22.04.2009
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SEMICONDUCTOR DEVICE AND FABRICATION THEREOF
MATSUO MIE, OKANO HARUO, WADA JUNICHI, SUGURO KYOICHI, HAYASAKA NOBUO, MIYAJIMA HIDESHI
Year of Publication 08.04.1994
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Year of Publication 08.04.1994
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Semiconductor device and method of manufacturing the same
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Year of Publication 16.06.2006
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Verfahren zur Herstellung einer Halbleiteranordnung
OKANO, HARUO, HAYASAKA, NOBUO, MATSUO, MIE, WADA, JUN-ICHI, SUGURO, KYOICHI, MIYAJIMA, HIDESHI
Year of Publication 29.08.2002
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Year of Publication 29.08.2002
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Halbleitervorrichtung vom gestapelten Typ
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Year of Publication 27.06.2002
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Year of Publication 27.06.2002
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Polishing method and polishing device
NAKATA, REMPEI, KAWASAKI, JP, HAYASAKA, NOBUO, YOKOSUKA, KANAGAWA, JP, OKANO, HARUO, TOKIO/TOKYO, JP, MATSUO, MIE, YOKOHAMA, JP, YANO, HIROYUKI, WAPPINGERS FALLS, N.Y., US, SASAKI, YASUTAKA, YOKOHAMA, JP, WADA, JUNICHI, YOKOHAMA, JP
Year of Publication 29.09.1994
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Year of Publication 29.09.1994
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Mfg. electrode or wiring layer on semiconductor device - forming metal oxide film and reducing to produce wiring layer e.g. of copper or silver
HAYASAKA, NOBUO, YOKOSUKA, KANAGAWA, JP, OKANO, HARUO, TOKIO/TOKYO, JP, SUGURO, KYOICHI, YOKOHAMA, KANAGAWA, JP, MATSUO, MIE, YOKOHAMA, KANAGAWA, JP, WADA, JUN-ICHI, YOKOHAMA, KANAGAWA, JP, MIYAJIMA, HIDESHI, TOKIO/TOKYO, JP
Year of Publication 10.02.1994
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Year of Publication 10.02.1994
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POLYACETAL-HARZZUSAMMENSETZUNG UND DARAUS HERGESTELLTE GLEITTEILE
OKAMURA, MICHIYA, IKEDA, MASAKAZU, YUI, HIROSHI, MATSUO, NORIO, YOKKAICHI-SHI MIE, JP
Year of Publication 11.03.1993
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Year of Publication 11.03.1993
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Ethylen/Alpha-Olefin Copolymer und Film davon
OHHAMA, TOSHIO, YOKKAICHI-SHI, MIE-KEN, JP, SONE, MAKOTO, MIE-GUN, MIE-KEN, JP, MATSUO, HIDEHIKO, YOKKAICHI-SHI, MIE-KEN, JP, YANO, AKIHIRO, YOKKAICHI-SHI, MIE-KEN, JP, SATOH, MORIHIKO, YOKKAICHI-SHI, MIE-KEN, JP, MIZU, MASUMI, YOKKAICHI-SHI, MIE-KEN, JP
Year of Publication 08.10.1998
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Year of Publication 08.10.1998
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