Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies
Park, Junghyun, Xu, Jiayou, Engler, Anthony, Williamson, Jaimal, Mathew, Varughese, Park, Sunggook, Flake, John C.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2024)
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Journal Article
Factors associated with health CEO turnover - a scoping review
Mathew, Nebu Varughese, Liu, Chaojie, Khalil, Hanan
Published in BMC health services research (29.07.2024)
Published in BMC health services research (29.07.2024)
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Journal Article
A Cu-Cu Wire-Bonding Enabled by a Cu-Selective Passivation Coating to Enhance Packaging Reliability
Alptekin, John, Antony Jesu Durai, Kevin, Kumaravel, Dinesh Kumar, Estridge, Logan, Chyan, Oliver, Ibrahim, Rusli, Li, Guangming, Mathew, Varughese
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2023)
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Journal Article
Litigation seeking access to data from ongoing clinical trials: a threat to clinical research
Kernan, Walter N, Viscoli, Catherine M, Varughese, Mathew C
Published in JAMA internal medicine (01.09.2014)
Published in JAMA internal medicine (01.09.2014)
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Journal Article
Enhancing Cu Wire-Bonding Reliability by a Cu-Selective Passivation Coating
Kumaravel, Dinesh Kumar, Durai, Kevin Antony Jesu, Nair, Shyam M, Nair, Shinoj S, Yu, Hailey Huijun, Alptekin, John, Chyan, Oliver M.R., Mathew, Varughese
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Through-Silicon Via Fill for 3D Interconnect Applications
Mathew, Varughese, Chatterjee, Ritwik, Jones, Robert, Garcia, Sam, Acosta, Eddie, Huang, Zhihong
Published in ECS transactions (20.03.2009)
Published in ECS transactions (20.03.2009)
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Journal Article
Thermal Conductivity and Interface Strength Evolution of TIM-Copper with Temperature and Humidity Conditioning
Lall, Pradeep, Kasturi, Madhu, Williamson, Jaimal, Mathew, Varughese
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Effect of Temperature and Humidity Conditioning on EMC-to-Substrate Interfacial Delamination Subjected to Monotonic and Fatigue Loading
Lall, Pradeep, Kasturi, Madhu, Williamson, Jaimal, Mathew, Varughese
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding