Search Results - "MATAYABAS, James C" :: K.UTB vyhledávací portál

RADIATION CURABLE COMPOSITIONS

by MATAYABAS JAMES C. JR, HUTCHINS MARCUS LEE, MILLER CHRISTOPHER WAYNE, WANG ZHIKAI JEFFREY
Year of Publication 30.07.2010

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MATERIALS COMPRISING LITHIUM ALUMINUM SILICATE FOR SEMICONDUCTOR MANUFACTURING TECHNIQUES, SEMICONDUCTOR PACKAGING TECHNIQUES, OR SEMICONDUCTOR PACKAGES

by ANANTHAKRISHNAN, Nisha, MATAYABAS, James C, LIN, Ziyin
Year of Publication 04.07.2019

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MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS

by MATAYABAS, James C., Jr, LIU, Boxi, DHAVALESWARAPU, Hemanth K, JAIN, Syadwad
Year of Publication 11.09.2019

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Methods of forming wafer level underfill materials and structures formed thereby

by Krishnan Arjun, Prakash Anna M, Matayabas James C, Ananthakrishnan Nisha
Year of Publication 25.04.2017

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MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS

by MATAYABAS, James C., Jr, LIU, Boxi, DHAVALESWARAPU, Hemanth K, JAIN, Syadwad
Year of Publication 21.11.2018

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MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS

by MATAYABAS, James C., Jr, LIU, Boxi, DHAVALESWARAPU, Hemanth K, JAIN, Syadwad
Year of Publication 20.07.2017

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Integrated heat spreader comprising a silver and sintering silver layered structure

by Nofen, Elizabeth, Matayabas, Jr., James C, Bai, Yiqun, Liang, Yawei
Year of Publication 24.01.2023

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Integrated heat spreader with enhanced vapor chamber for multichip packages

by Wan, Zhimin, Matayabas, Jr., James C, Chang, Je-Young, Arrington, Kyle
Year of Publication 23.07.2024

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METHODS OF FORMING WAFER LEVEL UNDERFILL MATERIALS AND STRUCTURES FORMED THEREBY

by ANANTHAKRISHNAN NISHA, PRAKASH ANNA M, KRISHNAN ARJUN, MATAYABAS JAMES C
Year of Publication 18.09.2014

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Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds

by Matayabas, Jr., James C, Tejeda Ferrari, Marely E, Gaines, Taylor, Bozorg-Grayeli, Elah
Year of Publication 23.01.2024

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Package structure to enhance yield of TMI interconnections

by Sidhu, Rajen S, De Bonis, Thomas J, Prack, Edward R, Prakash, Anna M, Zhang, Jason Jieping, Lin, Chang, Aravamudhan, Srinivasa R, Renavikar, Mukul P, Dani, Ashay A, Matayabas, James C, Deppisch, Carl L, May, Lilia
Year of Publication 14.08.2018

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FORMATION OF HOLES IN SUBSTRATES USING DEWETTING COATINGS

by SUPRIYA LAKSHMI, MATAYABAS JAMES C
Year of Publication 20.03.2008

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COMPONENT PACKAGING APPARATUS, SYSTEMS, AND METHODS

by KONING PAUL, MATAYABAS JAMES C
Year of Publication 31.01.2008

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POLYMER THERMAL INTERFACE MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY

by LOWE, JR. RANDALL D, JAIN SYADWAD, MATAYABAS JAMES C
Year of Publication 18.09.2014

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Package Structure To Enhance Yield of TMI Interconnections

by Renavikar Mukul P, Zhang Jason Jieping, Aravamudhan Srinivasa R, May Lilia, Deppisch Carl L, Sidhu Rajen S, Dani Ashay A, Prack Edward R, Lin Chang, De Bonis Thomas J, Prakash Anna M, Matayabas James C
Year of Publication 20.07.2017

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