Theoretical and experimental Raman study for mechanical stress in die-attach process
Uchida, Tomoyuki, Masuyama, Takumi, Sugie, Ryuichi, Watanabe, Satoshi
Published in Microelectronics and reliability (01.06.2021)
Published in Microelectronics and reliability (01.06.2021)
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Journal Article
OPTICAL MODULE
NAKAMURA NAOAKI, KAINUMA NORIO, KIRA HIDEHIKO, MATSUMURA TAKAYOSHI, FUKUSONO KENJI, MASUYAMA TAKUMI, HOSHINO YUKI, KUBOTA TAKASHI
Year of Publication 20.06.2019
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Year of Publication 20.06.2019
Patent
OPTICAL MODULE
NAKAMURA NAOAKI, KAINUMA NORIO, KIRA HIDEHIKO, MATSUMURA TAKAYOSHI, FUKUSONO KENJI, MASUYAMA TAKUMI, HOSHINO YUKI, KUBOTA TAKASHI
Year of Publication 20.12.2018
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Year of Publication 20.12.2018
Patent
OPTICAL MODULE
NAKAMURA NAOAKI, KAINUMA NORIO, KIRA HIDEHIKO, MATSUMURA TAKAYOSHI, FUKUSONO KENJI, MASUYAMA TAKUMI, HOSHINO YUKI, KUBOTA TAKASHI
Year of Publication 02.08.2018
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Year of Publication 02.08.2018
Patent
Theoretical and Experimental Raman Study for Mechanical Stress in Die-attach Process
Uchida, Tomoyuki, Masuyama, Takumi, Sugie, Ryuichi, Watanabe, Satoshi
Published in 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (20.07.2020)
Published in 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (20.07.2020)
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Conference Proceeding
Assembly Process Development of Ultra Large Scale 3D Stacking with Transmission Circuits Via TSVs
Kikuchi, Shunichi, Kira, Hidehiko, Suwada, Makoto, Nakada, Tatsumi, Nakamura, Naoaki, Kainuma, Norio, Kanai, Kazuhiro, Masuyama, Takumi
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Development of a stacking technology for large-sized chips using non-conductive film
Kira, Hidehiko, Kainuma, Norio, Nakamura, Naoaki, Kubota, Takashi, Masuyama, Takumi, Iijima, Sanae
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Development of high-performance ultra large scale 3D processor with high reliability packaging design
Tadaki, Shinji, Kitada, Hideki, Dote, Aki, Miyahara, Shouichi, Masuyama, Takumi, Kainuma, Norio, Nakamura, Naoaki, Kira, Hidehiko, Sakuyama, Seiki, Nakata, Tatsumi
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
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Conference Proceeding
Optical module
Hoshino, Yuki, Kainuma, Norio, Fukuzono, Kenji, Nakamura, Naoaki, Kubota, Takashi, Kira, Hidehiko, Matsumura, Takayoshi, Masuyama, Takumi
Year of Publication 10.03.2020
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Year of Publication 10.03.2020
Patent