Packaging of semiconductor integrated circuits
MASANORI TAZUNOKI, TOSHIYUKI SAKUTA, MINORU ENOMOTO, TOSHIHIKO SATOH, MAKOTO HOMMA, HIROMITSU MISHIMAGI, SHIGEO KURODA, KEIJI SASAKI, KAZUYA ITO, KUNIZO SAHARA, HISASHI NAKAMURA, KANJI OTSUKA, MASEO KAWAMURA, HINOKO KUROSAWA
Year of Publication 23.02.1996
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Year of Publication 23.02.1996
Patent