Investigation of wetting behavior of Sn-3Ag-0.5Cu solder paste to BGA solder ball
Yahya, M. H., Nakamura, K., Shohji, I., Housen, T., Yamamoto, Y., Kaga, Y.
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Get full text
Conference Proceeding