Search Results - "MARTIN JEREMY I" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Mechanical and Dielectric Properties of Pure-Silica-Zeolite Low-k Materials

Mechanical and Dielectric Properties of Pure-Silica-Zeolite Low-k Materials

by Li, Zijian, Johnson, Mark C., Sun, Minwei, Ryan, E. Todd, Earl, David J., Maichen, Wolfgang, Martin, Jeremy I., Li, Shuang, Lew, Christopher M., Wang, Junlan, Deem, Michael W., Davis, Mark E., Yan, Yushan
Published in Angewandte Chemie (International ed.) (25.09.2006)

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Journal Article

Impacts of US biodiesel mandates on world vegetable oil markets

Impacts of US biodiesel mandates on world vegetable oil markets

by Cui, Jingbo, Martin, Jeremy I.
Published in Energy economics (01.06.2017)

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Journal Article

Regarding your article “Baseline time accounting: considering global land use dynamics when estimating the climate impact of indirect land use change caused by biofuels.” Int J Life Cycle Assess 18(2):319–330. doi: 10.1007/s11367-012-0488-6

Regarding your article “Baseline time accounting: considering global land use dynamics when estimating the climate impact of indirect land use change caused by biofuels.” Int J Life Cycle Assess 18(2):319–330. doi: 10.1007/s11367-012-0488-6

by Martin, Jeremy I.
Published in The international journal of life cycle assessment (01.08.2013)

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Journal Article

Polymer-tethered ligand-receptor interactions between surfaces

Polymer-tethered ligand-receptor interactions between surfaces

by Martin, Jeremy I., Zhang, Cheng-Zhong, Wang, Zhen-Gang
Published in Journal of polymer science. Part B, Polymer physics (15.09.2006)

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Journal Article

Mechanical and Dielectric Properties of Pure-Silica-Zeolite Low-k Materials

Mechanical and Dielectric Properties of Pure-Silica-Zeolite Low-k Materials

by Li, Zijian, Johnson, Mark C., Sun, Minwei, Ryan, E. Todd, Earl, David J., Maichen, Wolfgang, Martin, Jeremy I., Li, Shuang, Lew, Christopher M., Wang, Junlan, Deem, Michael W., Davis, Mark E., Yan, Yushan
Published in Angewandte Chemie (25.09.2006)

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Journal Article

Polymer-tethered ligand-receptor interactions between surfaces: Modern Concepts and Methods in Polymer Physics

Polymer-tethered ligand-receptor interactions between surfaces: Modern Concepts and Methods in Polymer Physics

by MARTIN, Jeremy I, ZHANG, Cheng-Zhong, WANG, Zhen-Gang
Published in Journal of polymer science. Part B, Polymer physics (2006)

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Journal Article

Mechanical and Dielectric Properties of Pure‐Silica‐Zeolite Low‐ k Materials

Mechanical and Dielectric Properties of Pure‐Silica‐Zeolite Low‐ k Materials

by Li, Zijian, Johnson, Mark C., Sun, Minwei, Ryan, E. Todd, Earl, David J., Maichen, Wolfgang, Martin, Jeremy I., Li, Shuang, Lew, Christopher M., Wang, Junlan, Deem, Michael W., Davis, Mark E., Yan, Yushan
Published in Angewandte Chemie (25.09.2006)

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Journal Article

Graded oxide caps on low dielectric constant (low K) chemical vapor deposition (CVD) films

Graded oxide caps on low dielectric constant (low K) chemical vapor deposition (CVD) films

by Martin, Jeremy I, Tsui, Ting Yiu
Year of Publication 24.12.2002

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Patent

Graded oxide caps on low dielectric constant (low K) chemical vapor deposition (CVD) films

Graded oxide caps on low dielectric constant (low K) chemical vapor deposition (CVD) films

by MARTIN JEREMY I, TSUI TING YIU
Year of Publication 24.12.2002

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Patent

Copper damascene with low-k capping layer and improved electromigration reliability

Copper damascene with low-k capping layer and improved electromigration reliability

by MARTIN JEREMY I, VAN NGO MINH, RUELKE HARTMUT
Year of Publication 24.01.2006

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Patent

Copper damascene with low-k capping layer and improved electromigration reliability

Copper damascene with low-k capping layer and improved electromigration reliability

by van Ngo, Minh, Martin, Jeremy I, Ruelke, Hartmut
Year of Publication 24.01.2006

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Patent

Copper damascene with low-k capping layer and improved electromigration reliability

Copper damascene with low-k capping layer and improved electromigration reliability

by MARTIN JEREMY I, RUELKE HARTMUT, NGO MINH VAN
Year of Publication 28.09.2004

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Patent

Copper damascene with low-k capping layer and improved electromigration reliability

Copper damascene with low-k capping layer and improved electromigration reliability

by Ngo, Minh van, Martin, Jeremy I, Ruelke, Hartmut
Year of Publication 28.09.2004

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Patent

Resist trim process to define small openings in dielectric layers

Resist trim process to define small openings in dielectric layers

by Dakshina-Murthy, Srikanteswara, Besser, Paul R, Smith, Jonathan B, Apelgren, Eric M, Zistl, Christian, Martin, Jeremy I, Zhao, Lie Larry, Kepler, Nicholas John
Year of Publication 15.06.2010

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Patent

Resist trim process to define small openings in dielectric layers

Resist trim process to define small openings in dielectric layers

by ZHAO LIE LARRY, MARTIN JEREMY I, BESSER PAUL R, ZISTL CHRISTIAN, KEPLER NICHOLAS JOHN, SMITH JONATHAN B, DAKSHINA-MURTHY SRIKANTESWARA, APELGREN ERIC M
Year of Publication 15.06.2010

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Patent

Method for locally increasing sidewall density by ion implantation

Method for locally increasing sidewall density by ion implantation

by APELGREN ERIC M.,ZISTL CHRISTIAN,MARTIN JEREMY I.,BESSER PAUL R.,CHEUNG FRED
Year of Publication 16.05.2007

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Patent

Method and test structure for characterizing sidewall damage in a semiconductor device

Method and test structure for characterizing sidewall damage in a semiconductor device

by MARTIN JEREMY I, KEPLER NICHOLAS J, ZHAO LARRY L
Year of Publication 29.07.2003

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Patent

Method and test structure for characterizing sidewall damage in a semiconductor device

Method and test structure for characterizing sidewall damage in a semiconductor device

by Martin, Jeremy I, Kepler, Nicholas J, Zhao, Larry L
Year of Publication 29.07.2003

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Patent

Dual slurry particle sizes for reducing microscratching of wafers

Dual slurry particle sizes for reducing microscratching of wafers

by MARTIN JEREMY I, BESSER PAUL R, SMITH JONATHAN B
Year of Publication 25.09.2001

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Patent

Locally increasing sidewall density by ion implantation

Locally increasing sidewall density by ion implantation

by MARTIN JEREMY I, BESSER PAUL R, ZISTL CHRISTIAN, CHEUNG FRED, APELGREN ERIC M
Year of Publication 09.02.2005

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Patent