Ti liner for copper interconnect with low-k dielectric
Clevenger, Larry, Klepeis, Stanley J, Lu, Hsiao-Ling, Marino, Jeffrey R, Simon, Andrew Herbert, Wang, Yun-Yu, Wong, Kwong Hon, Yang, Chih-Chao
Year of Publication 09.12.2003
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Year of Publication 09.12.2003
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Ti liner for copper interconnect with low-k dielectric
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Year of Publication 09.12.2003
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Year of Publication 09.12.2003
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Structure and method for reducing thermo-mechanical stress in stacked vias
MELVILLE IAN D, DAS SANJIT K, ENGEL BRETT H, KASTENMEIER BERND E, HERBST BRIAN W, HICHRI HABIB, MARTIN ARTHUR, DALTON TIMOTHY J, VOLANT RICHARD P, MCGAHAY VINCENT J, NARAYAN CHANDRASEKHAR, PETRARCA KEVIN S, MARINO JEFFREY R, MALONE KELLY
Year of Publication 14.12.2004
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Year of Publication 14.12.2004
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Structure and method for reducing thermo-mechanical stress in stacked vias
Dalton, Timothy J, Das, Sanjit K, Engel, Brett H, Herbst, Brian W, Hichri, Habib, Kastenmeier, Bernd E, Malone, Kelly, Marino, Jeffrey R, Martin, Arthur, McGahay, Vincent J, Melville, Ian D, Narayan, Chandrasekhar, Petrarca, Kevin S, Volant, Richard P
Year of Publication 14.12.2004
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Year of Publication 14.12.2004
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STRUCTURE AND METHOD FOR REDUCING THERMAL MECHANICAL STRESS IN STACK AND VIA
MELVILLE IAN D, DAS SANJIT K, ENGEL BRETT H, KASTENMEIER BERND E, HERBST BRIAN W, HICHRI HABIB, MARTIN ARTHUR, DALTON TIMOTHY J, VOLANT RICHARD P, MCGAHAY VINCENT J, NARAYAN CHANDRASEKHAR, PETRARCA KEVIN S, MARINO JEFFREY R, MALONE KELLY
Year of Publication 08.07.2004
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Year of Publication 08.07.2004
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Structure and method for reducing thermo-mechanical stress in stacked vias
MELVILLE IAN D, DAS SANJIT K, ENGEL BRETT H, KASTENMEIER BERND E, HERBST BRIAN W, HICHRI HABIB, MARTIN ARTHUR, DALTON TIMOTHY J, VOLANT RICHARD P, MCGAHAY VINCENT J, NARAYAN CHANDRASEKHAR, PETRARCA KEVIN S, MARINO JEFFREY R, MALONE KELLY
Year of Publication 17.06.2004
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Year of Publication 17.06.2004
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EP0566901
FARRELL, CURTIS EDWARD, KANG, SUNG KWON, BRADY, MICHAEL JOHN, MARINO, JEFFREY ROBERT
Year of Publication 26.01.1994
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Year of Publication 26.01.1994
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Electronic devices having metallurgies containing copper-semiconductor compounds
FARRELL, CURTIS EDWARD, KANG, SUNG KWON, BRADY, MICHAEL JOHN, MARINO, JEFFREY ROBERT
Year of Publication 27.10.1993
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Year of Publication 27.10.1993
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A FIELD EMITTER DEVICE WITH A CURRENT LIMITER STRUCTURE
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Year of Publication 29.10.1998
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Year of Publication 29.10.1998
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Field emitter device with a current limiter structure
COSTA; MICHAEL J, MARINO; JEFFREY, ZIMMERMAN; STEVEN M, BOYSEL; R. MARK, SILVERNAIL; JEFFREY A, JONES; GARY W, JONES; SUSAN K, HO; JOSEPH K, LIU; YACHIN
Year of Publication 27.10.1998
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Year of Publication 27.10.1998
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A FIELD EMITTER DEVICE WITH A CURRENT LIMITER STRUCTURE
BOYSEL, ROBERT, MARK, SILVERNAIL, JEFFREY, A, LIU, YACHIN, JONES, SUSAN, K., S, ZIMMERMAN, STEVEN, M, JONES, GARY, W, MARINO, JEFFREY, HO, JOSEPH, K, COSTA, MICHAEL, J
Year of Publication 16.07.1998
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Year of Publication 16.07.1998
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Sacrificial metal liner for copper
STAMPER, ANTHONY K, GEFFKEN, ROBERT M, MARINO, JEFFREY R, COONEY, EDWARD C, SIMON, ANDREW H
Year of Publication 01.09.2004
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Year of Publication 01.09.2004
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Electronic devices having metallurgies containing copper-semiconductor compounds
WALKER; GEORGE FREDERICK, MARINO; JEFFREY ROBERT, MIKALSEN; DONALD JOSEPH, RIELEY; SHELDON COLE, BRADY; MICHAEL JOHN, KANG; SUNG KWON, PURUSHOTHAMAN; SAMPATH, FARRELL; CURTIS EDWARD, O'SULLIVAN; EUGENE JOHN, O'TOOLE; TERRENCE ROBERT, MOSKOWITZ; PAUL ANDREW
Year of Publication 05.01.1999
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Year of Publication 05.01.1999
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ELECTRONIC DEVICES HAVING METALLURGIES CONTAINING COPPER-SEMICONDUCTOR COMPOUNDS
FARRELL, CURTIS E, WALKER, GEORGE F, KANG, SUNG K, RIELEY, SHELDON C, PURUSHOTHAMAN, SAMPATH, MOSKOWITZ, PAUL A, MIKALSEN, DONALD J, MARINO, JEFFREY R, O'SULLIVAN, EUGENE J, O'TOOLE, TERRENCE R, BRADY, MICHAEL J
Year of Publication 24.11.1998
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Year of Publication 24.11.1998
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Electronic devices having metallurgies containing copper-semiconductor compounds
RIELEY; SHELDON C, FARRELL; CURTIS E, O'SULLIVAN; EUGENE J, KANG; SUNG K, O'TOOLE; TERRENCE R, MIKALSEN; DONALD J, PURUSHOTHAMAN; SAMPATH, BRADY; MICHAEL J, MARINO; JEFFREY R, MOSKOWITZ; PAUL A, WALKER; GEORGE F
Year of Publication 27.05.1997
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Year of Publication 27.05.1997
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ELECTRONIC DEVICES HAVING METALLURGIES CONTAINING COPPER-SEMICONDUCTOR COMPOUNDS
FARRELL, CURTIS E, WALKER, GEORGE F, KANG, SUNG K, RIELEY, SHELDON C, PURUSHOTHAMAN, SAMPATH, MOSKOWITZ, PAUL A, MIKALSEN, DONALD J, MARINO, JEFFREY R, O'SULLIVAN, EUGENE J, O'TOOLE, TERRENCE R, BRADY, MICHAEL J
Year of Publication 25.10.1993
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Year of Publication 25.10.1993
Patent
Ti liner for copper interconnect with low-k dielectric
CLEVENGER, LARRY, YUN-YU WANG, KLEPEIS, STANLEY J, MARINO, JEFFREY R, LU, HSIAO-LING, KWONG HON WONG, YANG, CHIN CHAO, SIMON, ANDREW H
Year of Publication 01.09.2004
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Year of Publication 01.09.2004
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METODO DE DEPOSICION DE MATERIAL QUE CONTIENE SI O GE SOBRE UNA SUPERFICIE DE CU O NI
FARRELL, CURTIS EDWARD, KANG, SUNG KWON, BRADY, MICHAEL JOHN, MARINO, JEFFREY ROBERT
Year of Publication 16.07.1999
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Year of Publication 16.07.1999
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Structure and method for reducing thermo-mechanical stress in stacked vias
VOLANT, RICHARD P, DALTON, TIMOTHY J, PETRARCA, KEVIN S, HERBST, BRIAN W, MELVILLE, IAN D, ENGEL, BRETT H, MCGAHAY, VINCENT J, MARTIN, ARTHUR, NARAYAN, CHANDRASEKHAR, MALONE, KELLY, MARINO, JEFFREY R, DAS, SANJIT K, KASTENMEIER, BERND E, HICHRI, HABIB
Year of Publication 01.03.2005
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Year of Publication 01.03.2005
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