Front- to back-side overlay optimization after wafer bonding for 3D integration
Marinier, Laurent, van Noort, Wibo, Pellens, Rudy, Sutedja, Budiman, Dekker, Ronald, van Zeijl, Henk
Published in Microelectronic engineering (01.04.2006)
Published in Microelectronic engineering (01.04.2006)
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Journal Article
Conference Proceeding
Removable pellicle for immersion lithography
DIRKSEN PETER, VAN STEENWINCKEL DAVID, AKSENOV YURI, LAMMERS JEROEN HERMAN, MORTON ROBERT DUNCAN, VAN WINGERDEN JOHANNES, MARINIER LAURENT, ZANDBERGEN PETER
Year of Publication 29.11.2011
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Year of Publication 29.11.2011
Patent