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SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING

by CABAHUG, Elsie Agdon, MANATAD, Romel N, ESTACIO, Maria Cristina
Year of Publication 31.10.2024

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Package including multiple semiconductor devices

by Im, Seungwon, Estacio, Maria Cristina, Teysseyre, Jerome
Year of Publication 03.01.2023

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Semiconductor device package with clip interconnect and dual side cooling

by Manatad, Romel N, Cabahug, Elsie Agdon, Estacio, Maria Cristina
Year of Publication 30.07.2024

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A PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

by TEYSSEYRE, Jerome, ESTACIO, Maria Cristina, IM, Seungwon
Year of Publication 03.01.2024

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SIC MOSFET SEMICONDUCTOR PACKAGES AND RELATED METHODS

by TEYSSEYRE, Jerome, CABAHUG, Elsie Agdon, ESTACIO, Maria Cristina
Year of Publication 29.06.2023

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A PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

by TEYSSEYRE, Jerome, ESTACIO, Maria Cristina, IM, Seungwon
Year of Publication 14.06.2023

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SiC MOSFET semiconductor packages and related methods

by Cabahug, Elsie Agdon, Estacio, Maria Cristina, Teysseyre, Jerome
Year of Publication 04.04.2023

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PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

by TEYSSEYRE, Jerome, ESTACIO, Maria Cristina, IM, Seungwon
Year of Publication 09.03.2023

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PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

by Im, Seungwon, Estacio, Maria Cristina, Teysseyre, Jerome
Year of Publication 20.05.2021

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A PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

by TEYSSEYRE, Jerome, ESTACIO, Maria Cristina, IM, Seungwon
Year of Publication 25.01.2023

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SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED METHODS

by YOO, Inpil, TEYSSEYRE, Jerome, ESTACIO, Maria Cristina, IM, Seungwon, EOM, JooYang
Year of Publication 01.08.2024

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Package including multiple semiconductor devices

by Im, Seungwon, Estacio, Maria Cristina, Teysseyre, Jerome
Year of Publication 02.02.2021

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Semiconductor packages using package in package systems and related methods

by Im, Seungwon, Estacio, Maria Cristina, Eom, JooYang, Teysseyre, Jerome, Yoo, Inpil
Year of Publication 14.05.2024

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Vertical and horizontal circuit assemblies

by Almagro, Erwin Ian, Dosdos, Bigildis, Estacio, Maria Cristina, Teysseyre, Jerome, Manatad, Romel, Wu, Chung-Lin
Year of Publication 22.08.2023

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SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING

by CABAHUG, Elsie Agdon, MANATAD, Romel N, ESTACIO, Maria Cristina
Year of Publication 11.11.2021

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Semiconductor device package with clip interconnect and dual side cooling

by Manatad, Romel N, Cabahug, Elsie Agdon, Estacio, Maria Cristina
Year of Publication 10.08.2021

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CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS

by CABAHUG, Elsie Agdon, MANATAD, Romel N, ESTACIO, Maria Cristina, QUINONES, Maria Clemens Ypil, ALMAGRO, Erwin Ian Vamenta
Year of Publication 14.12.2023

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SUBMODULE SEMICONDUCTOR PACKAGE

by YOO, Inpil, TEYSSEYRE, Jerome, ESTACIO, Maria Cristina, EOM, Jooyang, IM, Seungwon
Year of Publication 22.12.2022

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Package including multiple semiconductor devices

by Im, Seungwon, Estacio, Maria Cristina, Teysseyre, Jerome
Year of Publication 11.06.2019

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Concealed gate terminal semiconductor packages and related methods

by Manatad, Romel N, Almagro, Erwin Ian Vamenta, Cabahug, Elsie Agdon, Estacio, Maria Cristina, Quinones, Maria Clemens Ypil
Year of Publication 17.10.2023

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