Diffusion barrier performance of reactively sputtered Ta–W–N between Cu and Si
Liu, Yuzhang, Song, Shuangxi, Mao, Dali, Ling, Huiqin, Li, Ming
Published in Microelectronic engineering (01.09.2004)
Published in Microelectronic engineering (01.09.2004)
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Journal Article
Diffusion barrier performance of W/Ta–W–N double layers for Cu metallization
Song, Shuangxi, Liu, Yuzhang, Li, Ming, Mao, Dali, Chang, Chengkang, Ling, Huiqin
Published in Microelectronic engineering (01.03.2006)
Published in Microelectronic engineering (01.03.2006)
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Journal Article
Eu(2+) activated long persistent strontium aluminate nano scaled phosphor prepared by precipitation method
Chang, Chengkang, Yuan, Zhaoxin, Mao, Dali
Published in Journal of alloys and compounds (18.05.2006)
Published in Journal of alloys and compounds (18.05.2006)
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Journal Article
Microstructure evolution of Ag–8Au–3Pd alloy wire during electromigration
Guo, Rui, Gao, Liming, Li, Ming, Mao, Dali, Qian, Kaiyou, Chiu, Hope
Published in Materials characterization (01.12.2015)
Published in Materials characterization (01.12.2015)
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Journal Article
Preparation and in vitro bioactivities of calcium silicate nanophase materials
Wan, Xianghui, Chang, Chengkang, Mao, Dali, Jiang, Ling, Li, Ming
Published in Materials Science & Engineering C (01.06.2005)
Published in Materials Science & Engineering C (01.06.2005)
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Journal Article
Anodic fabrication and bioactivity of Nb-doped TiO2 nanotubes
Ding, Dongyan, Ning, Congqin, Huang, Lin, Jin, Fangchun, Hao, Yongqiang, Bai, Shuo, Li, Yan, Li, Ming, Mao, Dali
Published in Nanotechnology (29.07.2009)
Published in Nanotechnology (29.07.2009)
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Journal Article
Long lasting behavior of Gd2O2S:Eu3+ phosphor synthesized by hydrothermal routine
Hang, Tao, Liu, Qun, Mao, Dali, Chang, Chengkang
Published in Materials chemistry and physics (15.01.2008)
Published in Materials chemistry and physics (15.01.2008)
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Journal Article
Microstructure and mechanical properties of lead-free PV ribbon
Xuewei Wu, Dongyan Ding, Bai Han, Dali Mao
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
Electroless plating copper cones on leadframe to improve the adhesion with epoxy molding compound
Wenjing Zhang, Qin Lu, Tao Hang, Ming Li, Dali Mao
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
Low temperature bonding method using Cu micro cones
Qin Lu, Zhuo Chen, Anmin Hu, Ming Li, Dali Mao
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
Sample preparation device for molding compound adhesion test
Qin Lu, Wenjing Zhang, Ming Li, Dali Mao
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
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Conference Proceeding