Understanding Polymorphism in Organic Semiconductor Thin Films through Nanoconfinement
Diao, Ying, Lenn, Kristina M., Lee, Wen-Ya, Blood-Forsythe, Martin A., Xu, Jie, Mao, Yisha, Kim, Yeongin, Reinspach, Julia A., Park, Steve, Aspuru-Guzik, Alán, Xue, Gi, Clancy, Paulette, Bao, Zhenan, Mannsfeld, Stefan C. B.
Published in Journal of the American Chemical Society (10.12.2014)
Published in Journal of the American Chemical Society (10.12.2014)
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Journal Article
Probing the interfacial molecular packing in TIPS-pentacene organic semiconductors by surface enhanced Raman scattering
Xu, Jie, Diao, Ying, Zhou, Dongshan, Mao, Yisha, Giri, Gaurav, Chen, Wei, Liu, Nan, Mannsfeld, Stefan C. B., Xue, Gi, Bao, Zhenan
Published in Journal of materials chemistry. C, Materials for optical and electronic devices (01.01.2014)
Published in Journal of materials chemistry. C, Materials for optical and electronic devices (01.01.2014)
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Journal Article
PECVD METHOD TO DEPOSIT CONFORMAL AND LOW WET ETCH RATE ENCAPSULATION LAYER USING PECVD
WEI JOSEPH HUNG CHI, SINGHAL AKHIL, MAO YISHA, VAN SCHRAVENDIJK BART J
Year of Publication 15.11.2017
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Year of Publication 15.11.2017
Patent
Amorphous carbon layer opening process
Mao, Yisha, Faucett, Austin Casey, Tan, Zhongkui, Jin, Yansha, Qin, Ce
Year of Publication 15.06.2021
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Year of Publication 15.06.2021
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AMORPHOUS CARBON LAYER OPENING PROCESS
QIN, Ce, FAUCETT, Austin Casey, MAO, Yisha, JIN, Yansha, TAN, Zhongkui
Year of Publication 04.02.2021
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Year of Publication 04.02.2021
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AMORPHOUS CARBON LAYER OPENING PROCESS
QIN, Ce, FAUCETT, Austin Casey, MAO, Yisha, JIN, Yansha, TAN, Zhongkui
Year of Publication 28.08.2020
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Year of Publication 28.08.2020
Patent
AMORPHOUS CARBON LAYER OPENING PROCESS
QIN, Ce, FAUCETT, Austin Casey, MAO, Yisha, JIN, Yansha, TAN, Zhongkui
Year of Publication 08.08.2019
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Year of Publication 08.08.2019
Patent
METHOD TO DEPOSIT CONFORMAL AND LOW WET ETCH RATE ENCAPSULATION LAYER USING PECVD
Mao Yisha, Singhal Akhil, van Schravendijk Bart J, Wei Joseph Hung-chi
Year of Publication 09.11.2017
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Year of Publication 09.11.2017
Patent
A method of depositing a conformal and low wet etch rate encapsulation layer using PECVD
VAN SCHRAVENDIJK, BART J, WEI, JOSEPH HUNGI, MAO, YISHA, SINGHAL, AKHIL
Year of Publication 24.11.2017
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Year of Publication 24.11.2017
Patent