Carboneous coatings by rolling with 10% slip under mixed/boundary lubrication and high initial Hertzian contact pressures
Manier, C.-A., Spaltmann, D., Theiler, G., Woydt, M.
Published in Diamond and related materials (01.07.2008)
Published in Diamond and related materials (01.07.2008)
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Journal Article
Conference Proceeding
Slip-rolling resistance of high performance thin films and high toughness steel substrates under extreme conditions
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Conference Proceeding
Journal Article
Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, K., Manier, C.-A, Wilke, M., Oppermann, H., Ruffieux, D., Dekker, J., Jaakkola, A., Dalla Piazza, S., Allegato, G., Lang, K.-D
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing
Springborn, M., Wunderle, B., May, D., Mrossko, R., Manier, C.-A, Oppermann, H., Ras, M. Abo, Mitova, R.
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, K., Manier, C.-A, Wilke, M., Jurgensen, N., Oppermann, H., Ruffieux, D., Dekker, J., Heikkinen, Hannele, Dalla Piazza, S., Allegato, G., Lang, K.-D
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, K., Wilke, M., Wegner, M., Kaletta, K., Manier, C.-A, Oppermann, H., Wietstruck, M., Tillack, B., Kaynak, M., Lang, K.-D
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application
Springborn, M., Wunderle, B., May, D., Mrossko, R., Manier, C.-A, Ras, M. Abo, Oppermann, H., Xhonneux, T., Caroff, T., Mitova, R.
Published in 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2015)
Published in 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2015)
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Conference Proceeding
Wafer level 3D system integration based on silicon interposers with through silicon vias
Zoschke, K., Oppermann, H., Manier, C.-A, Ndip, I., Puschmann, R., Ehrmann, O., Wolf, J., Lang, Klaus-Dieter
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module: design, technology, performance and reliability within a system approach
Wunderle, B., Springborn, M., May, D., Heilmann, J., Manier, C. -A., Ras, M. Abo, Oppermann, H., Sarkany, Z., Mitova, R.
Published in 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2018)
Published in 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2018)
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Conference Proceeding
Phase change based thermal buffering of transient loads for power converter
Wunderle, B., Springborn, M., May, D., Mrossko, R., Ras, M. Abo, Manier, C.-A, Oppermann, H., Mitova, R.
Published in 20th International Workshop on Thermal Investigations of ICs and Systems (01.09.2014)
Published in 20th International Workshop on Thermal Investigations of ICs and Systems (01.09.2014)
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Conference Proceeding
Double-sided cooling and transient thermo-electrical management of Silicon on DCB assemblies for power converter modules: Design, technology and test
Wunderle, B., Springborn, M., May, D., Manier, C.-A, Abo Ras, M., Mrossko, R., Oppermann, H., Xhonneux, T., Caroff, T., Maurer, W., Mitova, R.
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
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Conference Proceeding
Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test
Wunderle, B., Manier, C.-A, Ras, M. Abo, Springborn, M., May, D., Oppermann, H., Toepper, M., Mrossko, R., Xhonneux, T., Caroff, T., Maurer, W., Mitova, R.
Published in 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2013)
Published in 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2013)
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Conference Proceeding
Slip-rolling resistance of ta-C and a-C coatings up to 3,000 MPa of maximum Hertzian contact pressure; Wälzbeständigkeit von ta-C und a-C Dünnschichten bis zu 3.000 MPa maximaler Hertzscher Kontaktpressung
Woydt, M, Scholz, C, Manier, C.-A, Brückner, A, Weihnacht, V
Published in Materialwissenschaft und Werkstofftechnik (01.12.2012)
Published in Materialwissenschaft und Werkstofftechnik (01.12.2012)
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Journal Article
A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks
Ruffieux, D., Scolari, N., Giroud, F., Le, T. C., Piazza, S. D., Staub, F., Zoschke, K., Manier, C. A., Oppermann, H., Dekker, J., Suni, T., Allegato, G.
Published in 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers (01.02.2013)
Published in 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers (01.02.2013)
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Conference Proceeding
A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators
Ruffieux, D., Scolari, N., Le, T. C., Beuchat, P. A., Jaakkola, A., Pensala, T., Dekker, J., Dixit, P., Manier, C. A., Zoschke, K., Oppermann, H.
Published in 2014 European Frequency and Time Forum (EFTF) (01.06.2014)
Published in 2014 European Frequency and Time Forum (EFTF) (01.06.2014)
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Conference Proceeding
Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Manier, C-A, Zoschke, K., Oppermann, H., Ruffieux, D., Dalla Piazza, S., Suni, T., Dekker, J., Allegato, G.
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
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Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Conference Proceeding
A miniature timing microsystem using two silicon resonators
Ruffieux, D., Baborowski, J., Scolari, N., Le, T. C., Jaakkola, A., Pensala, T., Dekker, J., Manier, C. A., Zoschke, K., Oppermann, H.
Published in 2013 Joint European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFC) (01.07.2013)
Published in 2013 Joint European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFC) (01.07.2013)
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Conference Proceeding