Search Results - "MANATAD, Romel N" :: K.UTB vyhledávací portál

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WIRELESS MODULE

by FLORES ALLAN TUNGUL, MANATAD ROMEL N, MANCELITA JAN VINCENT C
Year of Publication 17.03.2014

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POWER QUAD FLAT NO-LEAD SEMICONDUCTOR DIE PACKAGES WITH ISOLATED HEAT SINK FOR HIGH-VOLTAGE, HIGH-POWER APPLICATIONS, SYSTEMS USING THE SAME, AND METHODS OF MAKING THE SAME

by SON, JOON SEO, MANATAD ROMEL N
Year of Publication 25.06.2010

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Method for maintaining solder thickness in flipchip attach packaging processes

by TANGPUZ CONSUELO N.,MANATAD ROMEL N.,RIOS MARGIE T.,CRUZ ERWIN V. R
Year of Publication 09.11.2005

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SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING

by CABAHUG, Elsie Agdon, MANATAD, Romel N, ESTACIO, Maria Cristina
Year of Publication 31.10.2024

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Semiconductor device package with clip interconnect and dual side cooling

by Manatad, Romel N, Cabahug, Elsie Agdon, Estacio, Maria Cristina
Year of Publication 30.07.2024

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Molded packaging for wide band gap semiconductor devices

by Manatad, Romel N, Almagro, Erwin Ian Vamenta, Dosdos, Bigildis, Quinones, Maria Clemens Ypil, Teysseyre, Jerome
Year of Publication 10.09.2024

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SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING

by CABAHUG, Elsie Agdon, MANATAD, Romel N, ESTACIO, Maria Cristina
Year of Publication 11.11.2021

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Semiconductor device package with clip interconnect and dual side cooling

by Manatad, Romel N, Cabahug, Elsie Agdon, Estacio, Maria Cristina
Year of Publication 10.08.2021

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CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS

by CABAHUG, Elsie Agdon, MANATAD, Romel N, ESTACIO, Maria Cristina, QUINONES, Maria Clemens Ypil, ALMAGRO, Erwin Ian Vamenta
Year of Publication 14.12.2023

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Concealed gate terminal semiconductor packages and related methods

by Manatad, Romel N, Almagro, Erwin Ian Vamenta, Cabahug, Elsie Agdon, Estacio, Maria Cristina, Quinones, Maria Clemens Ypil
Year of Publication 17.10.2023

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MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

by TEYSSEYRE, Jerome, DOSDOS, Bigildis, MANATAD, Romel N, QUINONES, Maria Clemens Ypil, ALMAGRO, Erwin Ian Vamenta
Year of Publication 28.07.2022

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SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING

by CABAHUG, Elsie Agdon, MANATAD, Romel N, ESTACIO, Maria Cristina
Year of Publication 26.12.2019

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CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS

by CABAHUG, Elsie Agdon, MANATAD, Romel N, ESTACIO, Maria Cristina, QUINONES, Maria Clemens Ypil, ALMAGRO, Erwin Ian Vamenta
Year of Publication 31.03.2022

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Patent