Search Results - "MAHLER, JOACHIM" :: K.UTB vyhledávací portál

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Impact of Reaction Shrinkage on Stress in Semiconductor Packages

by Mengel, Manfred, Mahler, Joachim
Published in Journal of electronic materials (01.11.2009)

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Journal Article

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Long-Term Stability of Mold Compounds and the Influence on Semiconductor Device Reliability

by Mahler, Joachim, Mengel, Manfred
Published in Journal of electronic materials (01.07.2012)

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Journal Article

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DIE ATTACH METHODS AND SEMICONDUCTOR DEVICES MANUFACTURED BASED ON SUCH METHODS

by MAHLER JOACHIM, STROBEL PETER, REICHERT BENJAMIN, LEE CHEN WEN, GARBIN GIOVANNI RAGASA
Year of Publication 27.11.2019

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Patent

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DIE ATTACH METHODS AND SEMICONDUCTOR DEVICES MANUFACTURED BASED ON SUCH METHODS

by MAHLER JOACHIM, STROBEL PETER, REICHERT BENJAMIN, LEE CHEN WEN, GARBIN GIOVANNI RAGASA
Year of Publication 14.02.2018

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Patent

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HALBLEITERPAKET UND VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERPAKETS

by Mahler, Joachim
Year of Publication 24.11.2022

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Patent

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Methods for Manufacturing Electronic Devices

by Mahler, Joachim, Bemmerl, Thomas
Year of Publication 05.11.2020

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Patent

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Power semiconductor devices and a method for forming a power semiconductor device

by Mahler, Joachim, Kolmeder, Guenther
Year of Publication 03.12.2019

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Patent

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SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING A SEMICONDUCTOR

by MAHLER JOACHIM
Year of Publication 06.08.2015

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Patent

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Semiconductor package and method for producing a semiconductor package

by JOACHIM MAHLER
Year of Publication 05.08.2015

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Patent

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Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure

by MAHLER JOACHIM
Year of Publication 14.07.2015

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Patent

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Joining Materials, Electronic Devices and Methods for Manufacturing Thereof

by Mahler, Joachim, Bemmerl, Thomas
Year of Publication 22.11.2018

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Patent

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Power Semiconductor Devices and a Method for Forming a Power Semiconductor Device

by Mahler, Joachim, Kolmeder, Guenther
Year of Publication 01.11.2018

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Patent

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Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit

by Mahler, Joachim, Hosseini, Khalil, Fuergut, Edward
Year of Publication 30.11.2021

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Patent

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Printed circuit boards having a dielectric layer which includes a polymer and methods of manufacturing such printed circuit boards

by Mahler, Joachim, Otremba, Ralf
Year of Publication 29.05.2018

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Patent

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Semiconductor die attach system and method

by Meyer-Berg, Georg, Mahler, Joachim
Year of Publication 21.05.2019

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Patent

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Semiconductor Die Attach System and Method

by Meyer-Berg, Georg, Mahler, Joachim
Year of Publication 11.04.2019

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Patent

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Printed Circuit Boards Having a Dielectric Layer Which Includes a Polymer and Methods of Manufacturing Such Printed Circuit Boards

by Mahler Joachim, Otremba Ralf
Year of Publication 20.07.2017

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Patent

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Chip package with cross-linked thermoplastic dielectric

by Meyer-Berg, Georg, Mahler, Joachim, Tutsch, Guenter
Year of Publication 01.12.2020

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Patent

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Printed circuit boards and methods of manufacturing thereof

by Mahler Joachim, Otremba Ralf
Year of Publication 09.05.2017

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Patent

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Semiconductor device with a heterogeneous solder joint and method for fabricating the same

by Lee, Swee Kah, Lum, Fong Mei, Mahler, Joachim, Muhammat Sanusi, Muhammad, Chan, Sook Woon
Year of Publication 20.06.2023

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Patent

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