Holistic Material Design for Reliability of Electronic Based Systems
Magnien, Julien, Brunner, Roland, Kraker, Elke
Published in BHM. Berg- und hüttenmännische Monatshefte (2024)
Published in BHM. Berg- und hüttenmännische Monatshefte (2024)
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Journal Article
Machine learning assisted calibration of a ductile fracture locus model
Baltic, Sandra, Asadzadeh, Mohammad Zhian, Hammer, Patrick, Magnien, Julien, Gänser, Hans-Peter, Antretter, Thomas, Hammer, René
Published in Materials & design (01.05.2021)
Published in Materials & design (01.05.2021)
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Journal Article
On the Elaboration of Metal-Ceramic Composite Coatings by Laser Cladding
Mertens, Anne, Carrus, Raoul, Magnien, Julien, Lecomte-Beckers, Jacqueline, L’Hoest, Thibaut
Published in Materials Science Forum (15.11.2016)
Published in Materials Science Forum (15.11.2016)
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Journal Article
Web Resource
Coupled damage variable based on fracture locus: Modelling and calibration
Baltic, Sandra, Magnien, Julien, Gänser, Hans-Peter, Antretter, Thomas, Hammer, René
Published in International journal of plasticity (01.03.2020)
Published in International journal of plasticity (01.03.2020)
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Journal Article
Current surface issues in additive manufacturing
Magnien, Julien, Cosemans, Patrick, Nutal, Nicolas, Kairet, Thomas
Published in Plasma processes and polymers (01.01.2020)
Published in Plasma processes and polymers (01.01.2020)
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Journal Article
비-공융 SN-BI-IN 솔더 합금
BAYER JAKOB, MAGNIEN JULIEN, MELNIC DAVID, SIROKY GEORG, KIESLINGER DIETMAR
Year of Publication 08.05.2024
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Year of Publication 08.05.2024
Patent
Effect of solder joint size and composition on liquid-assisted healing
Siroky, Georg, Kraker, Elke, Magnien, Julien, Melinc, David, Kieslinger, Dietmar, Kozeschnik, Ernst, Ecker, Werner
Published in Microelectronics and reliability (01.04.2021)
Published in Microelectronics and reliability (01.04.2021)
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Journal Article
Lap shear test for solder materials: Local stress states and their effect on deformation and damage
Siroky, Georg, Magnien, Julien, Melinc, David, Kozeschnik, Ernst, Kieslinger, Dietmar, Kraker, Elke, Ecker, Werner
Published in Microelectronics and reliability (01.06.2020)
Published in Microelectronics and reliability (01.06.2020)
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Journal Article
Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation
Mitterhuber, Lisa, Defregger, Stefan, Hammer, René, Magnien, Julien, Schrank, Franz, Hörth, Stefan, Hutter, Matthias, Kraker, Elke
Published in Microelectronics and reliability (01.12.2017)
Published in Microelectronics and reliability (01.12.2017)
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Journal Article
Thermal transient measurement and modelling of a power cycled flip-chip LED module
Mitterhuber, Lisa, Defregger, Stefan, Magnien, Julien, Rosc, Jördis, Hammer, René, Goullon, Lena, Hutter, Matthias, Schrank, Franz, Hörth, Stefan, Kraker, Elke
Published in Microelectronics and reliability (01.02.2018)
Published in Microelectronics and reliability (01.02.2018)
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Journal Article
A novel approach for evaluation of material interfaces in electronics
Khatibi, Golta, Czerny, Bernhard, Lassnig, Alice, Lederer, Martin, Nicolics, Johann, Magnien, Julien, Suhir, Ephraim
Published in 2016 IEEE Aerospace Conference (01.03.2016)
Published in 2016 IEEE Aerospace Conference (01.03.2016)
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Conference Proceeding
Automated peak detection for analysis of error propagations and validation of structure functions in reliability tests of LED systems
Fischer, Sandra, Magnien, Julien, Rothl, Heiko, Mitterhuber, Lisa, Kraker, Elke
Published in 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (27.09.2023)
Published in 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (27.09.2023)
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Conference Proceeding
Trigger specific failure in LED system by power and duty cycle patterns lifetime testing
Magnien, Julien, Mitterhuber, Lisa, Fladischer, Katrin, Rosc, Jordis, Kraker, Elke
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
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Conference Proceeding
Probabilistic Approach for Temperature Driven Fatigue Lifetime Data Analysis to Improve Prognostics and Health Management of LED Packages
Magnien, Julien, Dvorzak, Michaela, Kleb, Ulrike, Mucke, Manfred, Kraker, Elke
Published in 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (14.09.2020)
Published in 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (14.09.2020)
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Conference Proceeding