High-Precision Wafer-Level Cu-Cu Bonding for 3-DICs
Sugaya, Isao, Okada, Masashi, Mitsuishi, Hajime, Maeda, Hidehiro, Shimoda, Toshimasa, Izumi, Shigeto, Nakahira, Hosei, Okamoto, Kazuya
Published in IEEE transactions on electron devices (01.12.2015)
Published in IEEE transactions on electron devices (01.12.2015)
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Journal Article
New precision alignment methodology for CMOS wafer bonding
Sugaya, Isao, Mitsuishi, Hajime, Maeda, Hidehiro, Okada, Masashi, Okamoto, Kazuya
Published in 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (01.10.2014)
Published in 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (01.10.2014)
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Conference Proceeding
Demonstration of 50 nm Overlay Accuracy for Wafer-to-Wafer Bonding and Further Improvement Study
Mitsuishi, Hajime, Mori, Hiroshi, Maeda, Hidehiro, Ushijima, Mikio, Aramata, Masanori, Fukuda, Minoru, Okada, Masashi, Kanbayashi, Masahiro, Shimoda, Toshimasa, Sugaya, Isao
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Cuff actuator for adaptive holding condition around nerves
Konishi, Satoshi, Kobayashi, Taizou, Maeda, Hidehiro, Asajima, Shuzo, Makikawa, Masaaki
Published in SENS ACTUATORS, B CHEM (15.03.2002)
Published in SENS ACTUATORS, B CHEM (15.03.2002)
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Journal Article
Conference Proceeding
BONDING METHOD AND BONDING DEVICE
SUGAYA ISAO, KUWANO IKUSUKE, TSUNODA MASAO, MITSUISHI SO, FUKUDA MINORU, MAEDA HIDEHIRO
Year of Publication 16.04.2024
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Year of Publication 16.04.2024
Patent
제어 장치, 제어 방법 및 프로그램
YOSHIHASHI MASAHIRO, MITSUISHI HAJIME, MORI HIROSHI, MAEHARA YOSHIHIRO, SHIMODA TOSHIMASA, SHIOMI TAKASHI, TAKAHATA KISHOU, MAEDA HIDEHIRO
Year of Publication 12.10.2022
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Year of Publication 12.10.2022
Patent
BONDING METHOD BONDING DEVICE AND HOLDING MEMBER
TSUNODA MASAKI, MITSUISHI HAJIME, SUGAYA ISAO, KUWANO IKUHIRO, FUKUDA MINORU, MAEDA HIDEHIRO
Year of Publication 11.07.2022
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Year of Publication 11.07.2022
Patent
LAYERED PRODUCT FORMING DEVICE AND LAYERED PRODUCT FORMING METHOD
FUKUDA Minoru, MAEDA Hidehiro, MITSUISHI Hajime, YOSHIHASHI Masahiro, SUGAYA Isao
Year of Publication 10.09.2020
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Year of Publication 10.09.2020
Patent
High-precision wafer-level Cu-Cu bonding for 3DICs
Okada, Masashi, Sugaya, Isao, Mitsuishi, Hajime, Maeda, Hidehiro, Shimoda, Toshimasa, Izumi, Shigeto, Nakahira, Hosei, Okamoto, Kazuya
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)
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Conference Proceeding
CONTROL DEVICE, CONTROL METHOD, AND PROGRAM
SHIOMI Takashi, SHIMODA Toshimasa, TAKAHATA Kishou, MAEDA Hidehiro, MITSUISHI Hajime, YOSHIHASHI Masahiro, MAEHARA Yoshihiro, MORI Hiroshi
Year of Publication 10.09.2021
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Year of Publication 10.09.2021
Patent
BONDING METHOD BONDING DEVICE AND HOLDING MEMBER
TSUNODA MASAKI, MITSUISHI HAJIME, SUGAYA ISAO, KUWANO IKUHIRO, FUKUDA MINORU, MAEDA HIDEHIRO
Year of Publication 07.07.2021
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Year of Publication 07.07.2021
Patent
JOINING METHOD AND JOINT DEVICE
SUGAYA ISAO, KUWANO IKUSUKE, TSUNODA MASAO, MITSUISHI SO, FUKUDA MINORU, MAEDA HIDEHIRO
Year of Publication 26.11.2020
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Year of Publication 26.11.2020
Patent
SUBSTRATE HOLDER, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING METHOD
KAMASHITA Atsushi, FUKUDA Minoru, MAEDA Hidehiro, MITSUISHI Hajime, SUGAYA Isao, OKADA Masashi
Year of Publication 12.11.2020
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Year of Publication 12.11.2020
Patent
접합 방법, 접합 장치, 및 유지 부재
TSUNODA MASAKI, MITSUISHI HAJIME, SUGAYA ISAO, KUWANO IKUHIRO, FUKUDA MINORU, MAEDA HIDEHIRO
Year of Publication 05.06.2019
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Year of Publication 05.06.2019
Patent