Highly Integrated Assembly Processes Solutions for Double-Sided-SiP Package
Ma, Bo-Hao, Ho, David, Wang, Yu-Po, Yen, Freedman, Guo, Shawn, Chiu, Ryan
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
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Conference Proceeding
Metal recycling from waste memory modules efficiently and environmentally friendly by low-temperature alkali melts
Zhu, MingWei, Ma, HaoBo, He, Jie, Chen, Bin, Zhang, LiLi, Jiang, HongXiang, Sun, XiaoJun, Zhao, JiuZhou
Published in Science China. Technological sciences (01.11.2020)
Published in Science China. Technological sciences (01.11.2020)
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Journal Article
SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
Ma, Bo-Hao, Chen, Tai-Yu, Song, Isabella, Yu, Ta-Jen, Hsu, Wen-Sung, Huang, Yung-Cheng, Lin, Bing-Yeh, Yang, Bo-Jiun, Lin, Shih-Chin
Year of Publication 07.09.2023
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Year of Publication 07.09.2023
Patent
Method for fabricating electronic package
Lin, Chang-Fu, Ng, Kong-Toon, Ma, Bo-Hao, Huang, Chen-Yu, Tai, Rui-Feng, Chung, Chee-Key
Year of Publication 29.03.2022
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Year of Publication 29.03.2022
Patent
METHOD FOR FABRICATING ELECTRONIC PACKAGE
Lin, Chang-Fu, Ng, Kong-Toon, Ma, Bo-Hao, Huang, Chen-Yu, Tai, Rui-Feng, Chung, Chee-Key
Year of Publication 22.10.2020
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Year of Publication 22.10.2020
Patent
Electronic package
Lin, Chang-Fu, Ng, Kong-Toon, Ma, Bo-Hao, Huang, Chen-Yu, Tai, Rui-Feng, Chung, Chee-Key
Year of Publication 11.08.2020
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Year of Publication 11.08.2020
Patent
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
Lin, Chang-Fu, Ng, Kong-Toon, Ma, Bo-Hao, Huang, Chen-Yu, Tai, Rui-Feng, Chung, Chee-Key
Year of Publication 01.08.2019
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Year of Publication 01.08.2019
Patent
HIGH-BANDWIDTH-PACKAGE-ON-PACKAGE STRUKTUR
Ma, Bo-Hao, Chen, Tai-Yu, Hsu, Yao-Pang, Yu, Ta-Jen, Hsu, Wen-Sung, Pan, Tsung-Yu, Yang, Bo-Jiun, Chen, Yin-Fa
Year of Publication 07.09.2023
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Year of Publication 07.09.2023
Patent
HALBLEITER-PACKAGESTRUKTUR
Ma, Bo-Hao, Chang, Chih-Wei, Chen, Tai-Yu, Yu, Ta-Jen, Hsu, Wen-Sung, Pan, Tsung-Yu, Yang, Bo-Jiun, Chen, Yin-Fa, Lin, Shih-Chin
Year of Publication 17.08.2023
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Year of Publication 17.08.2023
Patent
HALBLEITERPACKAGE-BAUGRUPPE
Chen, Chin-Lai, Ma, Bo-Hao, Chen, Tai-Yu, Su, Haw-Kuen, Hsu, Wen-Sung, Yu, Ta-Jen, Chen, Hsiao-Yun, Yang, Bo-Jiun, Ho, Duen-Yi
Year of Publication 16.02.2023
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Year of Publication 16.02.2023
Patent