Conductivity of high-temperature annealed silicon direct wafer bonds
Schjølberg-Henriksen, Kari, Tvedt, Lars Geir Whist, Gjelstad, Stein Are, Mørk, Christopher, Moe, Sigurd T., Imenes, Kristin, Poppe, Erik, Wang, Dag T.
Published in Microsystem technologies : sensors, actuators, systems integration (01.05.2015)
Published in Microsystem technologies : sensors, actuators, systems integration (01.05.2015)
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Journal Article
Bond strength of conductive Si-Si fusion bonded seals
Schjolberg-Henriksen, Kari, Tvedt, Lars Geir Whist, Moe, Sigurd, Poppe, Erik, Wang, Dag, Gjelstad, Stein Are, Mork, Christopher, Imenes, Kristin
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
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Conference Proceeding