Low‐temperature ultrasound‐activated joining of ZrO 2 ceramics using Sn–Al–Cu solder
Dong, Hongjie, Li, Zhuolin, Song, Xiaoguo, Guo, Xiajun, Luo, Yanxu, Bai, Tiansheng, Wei, Shoujing, Zhao, Hongyun, Yan, Jiuchun, Feng, Jicai
Published in Journal of the American Ceramic Society (01.05.2019)
Published in Journal of the American Ceramic Society (01.05.2019)
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Journal Article
Low‐temperature ultrasound‐activated joining of ZrO2 ceramics using Sn–Al–Cu solder
Dong, Hongjie, Li, Zhuolin, Song, Xiaoguo, Guo, Xiajun, Luo, Yanxu, Bai, Tiansheng, Wei, Shoujing, Zhao, Hongyun, Yan, Jiuchun, Feng, Jicai
Published in Journal of the American Ceramic Society (01.05.2019)
Published in Journal of the American Ceramic Society (01.05.2019)
Get full text
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