Vertical metal interconnect thanks to tungsten direct bonding
Di Cioccio, Léa, Gueguen, Pierric, Grouiller, Etienne, Vandroux, Laurent, Delaye, Vincent, Rivoire, Maurice, Lugand, Jean François, Clavelier, Laurent
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Full CMP integration of CVD TiN damascene sub-0.1-μm metal gate devices for ULSI applications
Ducroquet, F., Achard, H., Coudert, F., Previtali, B., Lugand, J.-F., Ulmer, L., Farjot, T., Gobil, Y., Heitzmann, M., Tedesco, S., Nier, M.E., Deleonibus, S.
Published in IEEE transactions on electron devices (01.08.2001)
Published in IEEE transactions on electron devices (01.08.2001)
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Journal Article