Innovative scheme for selective carbon nanotubes integration in via structures
Fayolle, M., Pontcharra, J., Dijon, J., Fournier, A., Okuno, H., Quesnel, E., Muffato, V., Jayet, C., Lugand, J.F., Gautier, P., Vandroux, L., Huet, S., Grampeix, H., Yckache, K., Mariolle, D., Billon, T.
Published in Microelectronic engineering (01.05.2011)
Published in Microelectronic engineering (01.05.2011)
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Journal Article
Conference Proceeding
Mid-process through silicon vias technology using tungsten metallization: Process optimazation and electrical results
Pares, G., Minoret, S., Lugand, J.F., Huet, S., Lapras, V., Anciant, R., Henry, D., Sillon, N., Dunne, B.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Full CMP Integration of TiN Damascene Metal Gate Devices
Achard, H., Ducroquet, F., Coudert, F., Previtali, B., Lugand, J.F., Ulmer, L., Farjot, T., Gobil, Y., Heitzmann, M., Tedesco, S., Nier, M.E., Deleonibus, S.
Published in 30th European Solid-State Device Research Conference (2000)
Published in 30th European Solid-State Device Research Conference (2000)
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Conference Proceeding