by Fayolle, M., Pontcharra, J., Dijon, J., Fournier, A., Okuno, H., Quesnel, E., Muffato, V., Jayet, C., Lugand, J.F., Gautier, P., Vandroux, L., Huet, S., Grampeix, H., Yckache, K., Mariolle, D., Billon, T.
Published in Microelectronic engineering (01.05.2011)

by Ducroquet, F., Achard, H., Coudert, F., Previtali, B., Lugand, J.-F., Ulmer, L., Farjot, T., Gobil, Y., Heitzmann, M., Tedesco, S., Nier, M.E., Deleonibus, S.
Published in IEEE transactions on electron devices (01.08.2001)

by Pares, G, Bresson, N, Minoret, S, Lapras, V, Brianceau, P, Lugand, J F, Anciant, R, Sillon, N
Published in 2011 IEEE International Conference on IC Design & Technology (01.05.2011)

by Ducroquet, F, Achard, H, Coudert, F, Previtali, B, Lugand, J.-F, Ulmer, L, Farjot, T, Gobil, Y, Heitzmann, M, Tedesco, S, Nier, M.E, Deleonibus, S
Published in IEEE transactions on electron devices (01.08.2001)

by Ducroquet, F., Achard, H., Coudert, F., Previtali, B., Lugand, J.-F., Ulmer, L., Farjot, T., Gobil, Y., Heitzmann, M., Tedesco, S., Nier, M.E., Deleonibus, S.
Published in IEEE transactions on electron devices (01.08.2001)

by Ducroquet, F, Achard, H, Coudert, F, Previtali, B, Lugand, J-F, Ulmer, L, Farjot, T, Gobil, Y, Heitzmann, M, Tedesco, S, Nier, M E, Deleonibus, S
Published in IEEE transactions on electron devices (01.08.2001)

by Fayolle, M., Lugand, J. F., Kachtouli, R., Okuno, H., Dijon, J., Gautier, P., Billon, T.
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)

by Pares, G., Minoret, S., Lugand, J.F., Huet, S., Lapras, V., Anciant, R., Henry, D., Sillon, N., Dunne, B.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)

by Achard, H., Ducroquet, F., Coudert, F., Previtali, B., Lugand, J.F., Ulmer, L., Farjot, T., Gobil, Y., Heitzmann, M., Tedesco, S., Nier, M.E., Deleonibus, S.
Published in 30th European Solid-State Device Research Conference (2000)

by Demolliens, O., Morand, Y., Fayolle, M., Cochet, M., Assous, M., Feldis, H., Lonis, D., Royer, J.C., Gobil, Y., Passemard, G., Maury, P., Jourdan, F., Cordeau, M., Morel, T., Perroud, L., Ulmer, L., Lugard, J.F., Renaud, D.
Published in Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) (2000)