Assessing Ink Transfer Performance of Gravure-Offset Fine-Line Circuitry Printing
Cheng, Hsien-Chie, Chen, You-Wei, Chen, Wen-Hwa, Lu, Su-Tsai, Lin, Shih-Ming
Published in Journal of electronic materials (01.03.2018)
Published in Journal of electronic materials (01.03.2018)
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Journal Article
Process-dependent Thermal-Mechanical Behaviors of an Advanced Thin-Flip-Chip-on-Flex Interconnect Technology with Anisotropic Conductive Film Joints
Cheng, Hsien-Chie, Chien-Hao, Ma, Ching-Feng, Yu, Su-Tsai, Lu, Wen-Hwa, Chen
Published in Computers, materials & continua (2013)
Published in Computers, materials & continua (2013)
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Journal Article
Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects With Ultra-Fine Pitch
LU, Su-Tsai, LIN, Yu-Min, CHUANG, Chun-Chih, CHEN, Tai-Hong, CHEN, Wen-Hwa
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2011)
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Journal Article
Hygro-thermo-mechanical Behavior of Adhesive-Based Flexible Chip-on-Flex Packaging
Cheng, Hsien-Chie, Huang, Ho-Hsiang, Chen, Wen-Hwa, Lu, Su-Tsai
Published in Journal of electronic materials (01.04.2015)
Published in Journal of electronic materials (01.04.2015)
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Journal Article
Assembly and reliability characterization of 3D chip stacking with 30μm pitch lead-free solder micro bump interconnection
Chau-Jie Zhan, Chun-Chih Chuang, Jing-Ye Juang, Su-Tsai Lu, Tao-Chih Chang
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Reliability of ultra-thin chip-on-flex (UTCOF) with anisotropic conductive adhesive (ACA) joints
Su-Tsai Lu, Wen-Hwa Chen
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film
Yu-Wei Huang, Yu-Min Lin, Chau-Jie Zhan, Su-Tsai Lu, Shin-Yi Huang, Jing-Ye Juang, Chia-Wen Fan, Su-Ching Chung, Jon-Shiou Peng, Su-Mei Chen, Yu-Lan Lu, Pai-Cheng Chang, Lau, John H.
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)
Jing-Ye Juang, Su-Tsai Lu, Su-Ching Chung, Su-Mei Cheng, Jong-Shiou Peng, Yu-Lan Lu, Pai-Cheng Chang, Chia-Wen Fan, Chau-Jie Zhan, Tai-Hung Chen
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
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Conference Proceeding
Evaluation of fine-pitch chip-to-chip interconnects using ACF material with arrayed particles
Yu-Wei Huang, Su-Tsai Lu, Jon-Shiou Peng, Chia-Wen Fan, Su-Ching Chung, Su-Mei Chen, Yu-Lan Lu, Pai-Cheng Chang, Chau-Jie Zhan
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
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Conference Proceeding
A novel compliant-bump structure for ACA-bonded chip-on-flex (COF) interconnects with ultra-fine pitch
Su-Tsai Lu, Yu-Min Lin, Chun-Chin Chuang, Tai-Hong Chen, Wen-Hwa Chen
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Theoretical and experimental characterization of process-induced thermal-mechanical behaviors of an ultra-thin chip-on-film assembly
Hsien-Chie Cheng, Hsiang-Chung Ho, Su-Tsai Lu
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
Evaluating fine-pitch chip-on-flex with non-conductive film by using multi-points compliant bump structure
Yu-Wei Huang, Su-Tsai Lu, Tai-Hong Chen
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding
An innovative chip-to-wafer and wafer-to-wafer stacking
Wei-Chung Lo, Yu-Hua Chen, Jeng-Dar Ko, Tzu-Ying Kuo, Ying-Ching Shih, Su-Tsai Lu
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Development and characterization of rigid-flex interface
Su-Tsai Lu, Wei-Chung Lo, Tai-Hong Chen, Yu-Hua Chen, Shu-Ming Chang, Yu-Wei Huang, Yuan-Chang Lee, Tzu-Ying Kuo, Ying-Ching Shih
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Temperature effects on ink transfer performance of gravure offset printing for fine-line circuitry
Yun-Hui Shen, Hsien-Chie Cheng, You-Wei Chen, Su-Tsai Lu, Shih-Ming Lin, Wen-Hwa Chen
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
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Conference Proceeding