Measurements and Modelling of Thermally Induced Warpages of DIMM Socket Server PCB Assembly after Solder Reflow Processes
Tsai, Ming-Yi, Wang, Yu-Wen, Lu, Yen-Jui, Lu, Tzu-Min, Chung, Shu-Tan
Published in Materials (19.04.2023)
Published in Materials (19.04.2023)
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