Silicon Interposer Warpage Study for 2.5D IC without TSV Utilizing Glass Carrier CTE and Passivation Thickness Tuning
Chieh-Lung Lai, Hung-Yuan Li, Chen, Allen, Terren Lu
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology
Kwon, Woon-Seong, Kim, Myongseob, Chang, Jonathan, Ramalingam, Suresh, Madden, Liam, Tsai, Genie, Tseng, Stephen, Lai, J.Y., Lu, Terren, Chiu, Steve
Published in Journal of microelectronics and electronic packaging (01.08.2015)
Published in Journal of microelectronics and electronic packaging (01.08.2015)
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Journal Article
Warpage Study of Large 2.5D IC Chip Module
Chieh-Lung Lai, Hung-Yuan Li, Peng, Sam, Lu, Terren, Chen, Stephen
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Integration study of die strength and various bumping volume and reliability performance on 2.5D silicon interposer assembly
Shih-Liang Peng, Chen-Yu Huang, Ming-Hsien Yang, Tseng, Stephen, Lai, J. Y., Lu, Terren, Hsien-Wen Chen, Chiu, Steve, Chen, Stephen
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding