Diffusiophoresis of a Weakly Charged Liquid Metal Droplet
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Published in Molecules (Basel, Switzerland) (05.05.2023)
Published in Molecules (Basel, Switzerland) (05.05.2023)
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Electrophoresis of a weakly charged dielectric fluid droplet in a cylindrical pore
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Warpage Simulation on a Typical Fan-out Panel Level Package (FOPLP) Process with Glass Carrier
Lo, Wei-Chen, Lwo, Ben-Je, Chung, Hsien, Ni, Tom, Lu, Shirley
Published in 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2019)
Published in 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2019)
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Conference Proceeding
Challenge of 12″ CIS CSP development, explore via finite element method
Ni, Tom, Su, Scott, Cheng, Anna, Lu, Shirley, Su, Teddy, Chang, C. C., Fang, David, Tai, Johnson
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
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Conference Proceeding
Contact resistance of the micro bumps in a typical TSV structure
Ben-Je Lwo, Chia-Liang Teng, Ni, Tom, Lu, Shirley
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
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Conference Proceeding