Search Results - "Lu, Guo-Quan" :: K.UTB vyhledávací portál

A Double-Side Cooled SiC MOSFET Power Module With Sintered-Silver Interposers: I-Design, Simulation, Fabrication, and Performance Characterization

by Ding, Chao, Liu, Heziqi, Ngo, Khai D. T., Burgos, Rolando, Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.10.2021)

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Reliability Evaluation of Multichip Phase-Leg IGBT Modules Using Pressureless Sintering of Nanosilver Paste by Power Cycling Tests

by Fu, Shancan, Mei, Yunhui, Li, Xin, Ma, Changsheng, Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.08.2017)

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Characterization of a Nonlinear Resistive Polymer-Nanoparticle Composite Coating for Electric Field Reduction in a Medium-Voltage Power Module

by Zhang, Zichen, Ngo, Khai D.T., Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.03.2022)

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Pressureless Silver Sintering on Nickel for Power Module Packaging

by Wang, Meiyu, Mei, Yunhui, Li, Xin, Burgos, Rolando, Boroyevich, Dushan, Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.08.2019)

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Packaging Design of 15 kV SiC Power Devices With High-Voltage Encapsulation

by Li, Junjie, Liang, Yu, Mei, Yunhui, Tang, Xinling, Lu, Guo-Quan
Published in IEEE transactions on dielectrics and electrical insulation (01.02.2022)

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Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging

by Wang, Meiyu, Mei, Yun-Hui, Jin, Jingyou, Chen, Shi, Li, Xin, Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.11.2021)

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Improved Measurement Accuracy for Junction-to-Case Thermal Resistance of GaN HEMT Packages by Gate-to-Gate Electrical Resistance and Stacking Thermal Interface Materials

by Lu, Shengchang, Zhang, Zichen, Buttay, Cyril, Ngo, Khai, Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.06.2022)

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Chip Size Minimization for Wide and Ultrawide Bandgap Power Devices

by Wang, Boyan, Xiao, Ming, Zhang, Zichen, Wang, Yifan, Qin, Yuan, Song, Qihao, Lu, Guo-Quan, Ngo, Khai, Zhang, Yuhao
Published in IEEE transactions on electron devices (01.02.2023)

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Packaging of a 10-kV Double-Side Cooled Silicon Carbide Diode Module With Thin Substrates Coated by a Nonlinear Resistive Polymer-Nanoparticle Composite

by Zhang, Zichen, Lu, Shengchang, Wang, Boyan, Zhang, Yuhao, Yun, Nick, Sung, Woongje, Ngo, Khai D. T., Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.12.2022)

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Copper-Wire Stress Buffers for Extending Lifetime of Double-Sided Bidirectional SiC Modules

by Liu, Siqi, Mei, Yun-Hui, Li, Jing, Li, Xin, Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.06.2023)

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Reducing Migration of Sintered Ag for Power Devices Operating at High Temperature

by Li, Dan, Mei, Yunhui, Xin, Yunchang, Li, Zhiqiao, Chu, Paul K., Ma, Changsheng, Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.12.2020)

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Additive Manufacturing of Toroid Inductor for Power Electronics Applications

by Yi Yan, Moss, Jim, Ngo, Khai D. T., Yunhui Mei, Guo-Quan Lu
Published in IEEE transactions on industry applications (01.11.2017)

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Two-Dimensional Mapping of Interface Thermal Resistance by Transient Thermal Measurement

by Gao, Shan, Ngo, Khai D. T., Lu, Guo-Quan
Published in IEEE transactions on industrial electronics (1982) (01.05.2021)

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Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors

by Lu, Shengchang, Zhao, Tianyu, Zhang, Zichen, Ngo, Khai D. T., Burgos, Rolando, Lu, Guo-Quan
Published in IEEE transactions on industrial electronics (1982) (01.01.2023)

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A Method for Improving the Thermal Shock Fatigue Failure Resistance of IGBT Modules

by Zhang, Xinyin, Wang, Meiyu, Li, Xin, Ding, Zikun, Ma, Changsheng, Lu, Guo-Quan, Mei, Yunhui
Published in IEEE transactions on power electronics (01.08.2020)

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Reliable Aluminum Wire-Bonded SiC/Si Diodes With Laminated Al/Cu Stress Buffers

by Li, Xiao-Di, Lu, Guo-Quan, Mei, Yun-Hui
Published in IEEE transactions on power electronics (01.09.2022)

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Continuously Variable Multi-Permeability Inductor for Improving the Efficiency of High-Frequency DC-DC Converter

by Liu, Junchang, Mei, Yunhui, Lu, Shengchang, Li, Xin, Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.01.2020)

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Effective Field Grading at 200 °C of a Nonlinear Resistive Polymer Nanocomposite Coating for Medium-Voltage Power Modules

by Zhang, Zichen, Yuchi, Qingrui, Nicholas, Carl, Ngo, Khai D.T., Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.04.2024)

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Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science

by Wang, Meiyu, Mei, Yunhui, Hu, Weibo, Li, Xin, Lu, Guo-Quan
Published in IEEE journal of emerging and selected topics in power electronics (01.04.2022)

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Desired Properties of a Nonlinear Resistive Coating for Shielding Triple Point in a Medium-Voltage Power Module

by Xu, Jiayu, Zhang, Zichen, Ngo, Khai D. T., Lu, Guo-Quan
Published in IEEE transactions on dielectrics and electrical insulation (01.10.2021)

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