Optimal rail system design with multiple layers of fault and event trees
Lu, Chun-Lin, Lai, Yung-Cheng (Rex)
Published in Journal of transportation safety & security (08.10.2021)
Published in Journal of transportation safety & security (08.10.2021)
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Journal Article
Stress analysis of glenoid component in design of reverse shoulder prosthesis using finite element method
Yang, Ching-Chieh, MD, Lu, Chun-Lin, MS, Wu, Chun-Hung, PhD, Wu, Jiunn-Jer, MD, Huang, Teng-Le, MD, PhD, Chen, Rongshun, PhD, Yeh, Meng-Kao, PhD
Published in Journal of shoulder and elbow surgery (01.07.2013)
Published in Journal of shoulder and elbow surgery (01.07.2013)
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Journal Article
Calcium pyrophosphate dihydrate deposition disease of the spleen
Hsu, Yuan-Chun, M.D, Chang, Chen-Wang, M.D, Lin, Chun-Lu, M.D, Lai, Chuan-Tsai, M.D
Published in The American journal of surgery (01.08.2010)
Published in The American journal of surgery (01.08.2010)
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Journal Article
MEMS capacitive microphone with various materials in acoustic plate under shock loading
Lu, Chun-Lin, Ni, Pei-Rong, Yeh, Meng-Kao
Published in Microelectronics and reliability (01.09.2020)
Published in Microelectronics and reliability (01.09.2020)
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Journal Article
Integrated High Aspect Ratio 3D High Density Capacitor in Si Interposer for 2.5D Advanced Packaging Applications
Lu, Chun-Lin, Ho, Cheng-Shu, Liu, Kuo-Wei, Wang, Guan-Deng, Ju, Min-Syong, So, Ka Man, Shih, Kai-Yao, Liao, Miller, Chang, Shou-Zen
Published in 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT) (17.04.2023)
Published in 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT) (17.04.2023)
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Conference Proceeding
A 5 to 45 GHz Distributed Mixer With Cascoded Complementary Switching Pairs
LIN, Yu-Sheng, LU, Chun-Lin, WANG, Yeong-Her
Published in IEEE microwave and wireless components letters (01.09.2013)
Published in IEEE microwave and wireless components letters (01.09.2013)
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Journal Article
Comprehensive Approach to Allocate Reliability and Cost in Passenger Rail System Design
Lai, Yung-Cheng (Rex), Lu, Chia-Tsung, Lu, Chun-Lin
Published in Transportation research record (01.01.2017)
Published in Transportation research record (01.01.2017)
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Journal Article
Demonstration of A 3D Chip by Logic-DRAM Stacked Using Paired TSV Interconnection through Interface for AI/Edge-Computing Application
Lu, Chun-Lin, Chen, Chun Cheng, Lin, Sheng-Chieh, Chuang, Chih-Hao, Shih, Kai-Yao, Liao, Hsin-Yi, Huang, Chin-Hung, Ju, Min-Syong, Ho, Cheng-Shu, Chen, Chi Ming, Chang, Shou-Zen
Published in 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT) (17.04.2023)
Published in 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT) (17.04.2023)
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Conference Proceeding
The Representation of OTA Images’ Astrometric Results with WCS-SIP Coefficientstwo
Ping, Yi-ding, Zhang, Chen, Lu, Chun-lin
Published in Chinese astronomy and astrophysics (01.04.2018)
Published in Chinese astronomy and astrophysics (01.04.2018)
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Journal Article