Reliability issues of lead-free solder joints in electronic devices
Jiang, Nan, Zhang, Liang, Liu, Zhi-Quan, Sun, Lei, Long, Wei-Min, He, Peng, Xiong, Ming-Yue, Zhao, Meng
Published in Science and technology of advanced materials (31.12.2019)
Published in Science and technology of advanced materials (31.12.2019)
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Journal Article
Materials, processing and reliability of low temperature bonding in 3D chip stacking
Zhang, Liang, Liu, Zhi-quan, Chen, Sinn-Wen, Wang, Yao-dong, Long, Wei-Min, Guo, Yong-huan, Wang, Song-quan, Ye, Guo, Liu, Wen-yi
Published in Journal of alloys and compounds (25.06.2018)
Published in Journal of alloys and compounds (25.06.2018)
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Journal Article
Stress analysis and structural optimization of 3-D IC package based on the Taguchi method
Xiong, Ming-Yue, Zhang, Liang, He, Peng, Long, Wei-Min
Published in Soldering & surface mount technology (17.01.2020)
Published in Soldering & surface mount technology (17.01.2020)
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Journal Article
Interfacial IMC growth behavior and mechanical properties of Cu/Sn58Bi/Cu and Cu/Sn58Bi–0.05AlN/Cu solder joints under ultrasonic-assisted soldering
Wang, Xi, Zhang, Liang, Chen, Chen, Lu, Xiao, Long, Wei-min
Published in Journal of materials science. Materials in electronics (01.02.2023)
Published in Journal of materials science. Materials in electronics (01.02.2023)
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Journal Article
Study on microstructure and properties of Sn–0.3Ag–0.7Cu solder bearing Nd
Xu, Jiachen, Xue, Songbai, Xue, Peng, Long, Wei-min, Zhang, Qing-ke
Published in Journal of materials science. Materials in electronics (01.08.2016)
Published in Journal of materials science. Materials in electronics (01.08.2016)
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Journal Article
Effect of Paste Flux Concentration on Adhesion Behavior
Du, Quan-Bin, Long, Wei-Min, Lu, Quan-Bin, Sun, Hua-Wei, Wang, Xing-Xing, Bao, Li
Published in Cai liao gong cheng = Journal of materials engineering (01.11.2017)
Published in Cai liao gong cheng = Journal of materials engineering (01.11.2017)
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Journal Article
Effect of Nd on tin whisker growth in Sn–Zn soldered joint
Xue, Peng, Wang, Ke-Hong, Zhou, Qi, Huang, Jun, Long, Wei-min, Zhang, Qing-ke
Published in Journal of materials science. Materials in electronics (01.04.2016)
Published in Journal of materials science. Materials in electronics (01.04.2016)
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Journal Article
Microstructure evolution mechanism and mechanical properties of AlNP/Al composites bonded to 6061Al at low temperature
Lin, Pan-Pan, Ma, Dian, Li, Hao-Yue, Wang, Zi-Ming, He, Peng, Lin, Tie-Song, Long, Wei-Min
Published in Cai liao gong cheng = Journal of materials engineering (01.10.2020)
Published in Cai liao gong cheng = Journal of materials engineering (01.10.2020)
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Journal Article
Evolution of microstructure and properties in reactive air brazing of 3YSZ ceramic and aluminized Crofer22h stainless steel using Pd-modified Ag–CuO filler
Zhou, Wen Long, Hu, Sheng Peng, Song, Xiao Guo, Luo, Yun, Cao, Jian, Long, Wei Min, Hu, Dai Jun
Published in Journal of materials science (01.04.2024)
Published in Journal of materials science (01.04.2024)
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Journal Article
Contact-reactive brazing mechanism of Al0.3CoCrFeNi high-entropy alloys using a niobium interlayer
Lei, Yu, Li, Yi-nan, Song, Xiao-guo, Hu, Sheng-peng, Long, Wei-min, Shi, Hai-chuan, Chen, Zu-bin
Published in Journal of iron and steel research, international (28.08.2024)
Published in Journal of iron and steel research, international (28.08.2024)
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