Parametric Study of Gravure Printing for Electric Heaters
Sunappan, V., Shan, X.C., Lok, B.K.
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Hybrid analytical modeling method for split power bus in multilayered package
Youchul Jeong, Lu, A.C.W., Wai, L.L., Wei Fan, Lok, B.K., Hyunjeong Park, Kim, Joungho
Published in IEEE transactions on electromagnetic compatibility (01.02.2006)
Published in IEEE transactions on electromagnetic compatibility (01.02.2006)
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Journal Article
355 nm DPSS UV laser cutting of FR4 and BT/epoxy-based PCB substrates
Wang, X.C., Li, Z.L., Chen, T., Lok, B.K., Low, D.K.Y.
Published in Optics and lasers in engineering (01.05.2008)
Published in Optics and lasers in engineering (01.05.2008)
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Journal Article
Investigation of Ta 2O 5/SiO 2/4H-SiC MIS capacitors
Zhao, P., Rusli, Lok, B.K., Lai, F.K., Tin, C.C., Zhao, J.H., Yar, R.M.
Published in Microelectronic engineering (2006)
Published in Microelectronic engineering (2006)
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Journal Article
355nm DPSS UV laser cutting of FR4 and BT/epoxy-based PCB substrates
Wang, X.C., Li, Z.L., Chen, T., Lok, B.K., Low, D.K.Y.
Published in Optics and lasers in engineering (01.05.2008)
Published in Optics and lasers in engineering (01.05.2008)
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Journal Article
Investigation of Ta2O5/SiO2/4H-SiC MIS capacitors
ZHAO, P, RUSLI, LOK, B. K, LAI, F. K, TIN, C. C, ZHAO, J. H, YAR, R. M
Published in Microelectronic engineering (2006)
Published in Microelectronic engineering (2006)
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Conference Proceeding
Journal Article
Multilayer Roll-to-Roll Screen-Printing for Printed Electronics Applications
Salam, B., Shan, X.C., Zhanhong, Cen, Lok, B.K.
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding
Solderability and reliability of printed electronics
Salam, B., Lok, B.K.
Published in 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2008)
Published in 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2008)
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Conference Proceeding
Mixed-mode S-parameter characterization of differential structures
Fan, W., Lu, A., Wai, L.L., Lok, B.K.
Published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (2003)
Published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (2003)
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Conference Proceeding
Characterization of Inkjet Printed MWCNT in Colloidal and Conductive Polymer Solution
Lok, B.K., Liang, Y.N., Ng, Y.M., Hu, X.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Optimizing manufacturing process of printed electronics
Salam, B., Gan, H.Y., Lok, B.K., Albert, L.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Process Integration of Inkjet Printing and Electroless Plating for LTCC Substrates
Lok, B.K., Liang, Y.N., Gian, P.W., Shan Xuechuan, Lu, A.C.W.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding
Kinetics of dewaxing neutral oils over ZSM-5
O'Rear, Dennis J, Lok, Brent K
Published in Industrial & engineering chemistry research (01.06.1991)
Published in Industrial & engineering chemistry research (01.06.1991)
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Journal Article
Effect of plasma treated ITO substrate on inkjet printing of conductive ink
Lok, B.K., Ng, P.Y., Hu, X., Low, H.P.
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding
Characterization of low temperature processing and high density integrated capacitor on organic substrate
Fan, W., Lok, B.K., Lu, A.C.W., Wai, L.L.
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding
Encapsulation and packaging of biosensor
Fan, W., Jeong, Y.W., Wei, J., Tan, B.K., Lok, B.K., Chun, K.J.
Published in 2005 7th Electronic Packaging Technology Conference (2005)
Published in 2005 7th Electronic Packaging Technology Conference (2005)
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Conference Proceeding
High aspect pattern formation by integration of micro inkjetting and electroless plating
Gian, P.W., Xuechuan Shan, Liang, Y.N., Lok, B.K., Lu, C.W., Ooi, B.L.
Published in 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (01.04.2008)
Published in 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (01.04.2008)
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Conference Proceeding
Analysis of noise suppression techniques using embedded capacitor on split power bus in multi-layer package
Youchul Jeong, Kim, Joungho, Lu, A.C.W., Wai, L.L., Wei Fan, Lok, B.K., Wong, C.K.
Published in 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) (2004)
Published in 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) (2004)
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Conference Proceeding