On thermal stresses and reliability of a PBGA chip scale package
Hong, Bor Zen, Su, Lo-Soun
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
Get full text
Conference Proceeding
Journal Article
Identification of speakers by use of nasal coarticulation
Su, L S, Li, K P, Fu, K S
Published in The Journal of the Acoustical Society of America (01.12.1974)
Published in The Journal of the Acoustical Society of America (01.12.1974)
Get more information
Journal Article
A 50mhz Multichip Processor Module With Flip Chip Technology
Miller, B., Volkringer, N., Lo-Soun Su, Yee Ming Ting, Mike Loo, Kumar, R., Smith, B.
Published in Proceedings of the International Conference on Multichip Modules (1994)
Published in Proceedings of the International Conference on Multichip Modules (1994)
Get full text
Conference Proceeding