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"Lo Wai Yew"
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"Lo Wai Yew"
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Array quad flat no-lead package and method of forming same
by
YIP HENG KEONG
,
LO WAI YEW
Year of Publication
12.05.2009
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Method of forming flip-chip bump carrier type package
by
YIP HENG KEONG
,
LO WAI YEW
Year of Publication
06.01.2009
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Capacitor attachment method
by
FOONG CHEE SENG
,
LO WAI YEW
Year of Publication
18.11.2008
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84
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Pressure sensor package
by
LEE BOON SEONG
,
ONG KAR YOKE
,
LO WAI YEW
Year of Publication
15.02.2011
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85
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ARRAY QUAD FLAT NO-LEAD PACKAGE AND METHOD OF FORMING SAME
by
YIP HENG KEONG
,
LO WAI YEW
Year of Publication
01.05.2008
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PRESSURE SENSOR PACKAGE
by
LEE BOON SEONG
,
ONG KAR YOKE
,
LO WAI YEW
Year of Publication
11.11.2010
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87
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Semiconductor wafer with improved crack protection
by
YIP HENG KEONG
,
TAN LAN CHU
,
LO WAI YEW
Year of Publication
22.06.2010
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METHOD OF MAKING SEMICONDUCTOR PACKAGE HAVING EXPOSED HEAT SPREADER
by
LO
,
WAI YEW
,
FOONG, CHEE SENG
Year of Publication
28.06.2007
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METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH REDUCED MOISTURE SENSITIVITY
by
LO
,
WAI YEW
,
OOI, PEI CHEN
Year of Publication
28.05.2007
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Method of making stacked die package
by
LO
,
WAI YEW
Year of Publication
01.12.2008
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91
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Method of forming flip-chip bump carrier type package
by
YIP, HENG KEONG
,
LO
,
WAI YEW
Year of Publication
11.03.2013
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92
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SEMICONDUCTOR WAFER WITH IMPROVED CRACK PROTECTION
by
YIP HENG KEONG
,
TAN LAN CHU
,
LO WAI YEW
Year of Publication
31.07.2008
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93
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Semiconductor sensor device and method of packaging same
by
TAN, LAN CHU
,
LO
,
WAI YEW
Year of Publication
16.01.2013
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Semiconductor sensor device and method of packaging same
by
TAN LAN CHU
,
LO WAI YEW
Year of Publication
05.12.2012
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95
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Stacked multichip package and method of making the same
by
TAN, KIM-HENG
,
ISMAIL, AMINUDDIN
,
LO
,
WAI
-
YEW
Year of Publication
11.10.2004
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96
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Pressure sensor and method of assembling same
by
TAN, LAN CHU
,
LO
,
WAI YEW
Year of Publication
16.07.2012
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Method of making stacked die package
by
LO
,
WAI
-
YEW
Year of Publication
01.04.2007
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Pressure sensor and method of assembling same
by
TAN LAN CHU
,
LO WAI YEW
Year of Publication
06.06.2012
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99
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Stacked die semiconductor device
by
ARIPIN AZHAR BIN
,
TIU KONG BEE
,
LO WAI YEW
Year of Publication
01.05.2007
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STACKED DIE SEMICONDUCTOR DEVICE
by
ISMAIL, AMINUDDIN
,
TAN, KIM, HENG
,
LO
,
WAI
,
YEW
Year of Publication
12.09.2003
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