Resilience of ultra-thin oxynitride films to percolative wear-out and reliability implications for high-κ stacks at low voltage stress
Raghavan, Nagarajan, Padovani, Andrea, Li, Xiang, Wu, Xing, Lip Lo, Vui, Bosman, Michel, Larcher, Luca, Leong Pey, Kin
Published in Journal of applied physics (07.09.2013)
Published in Journal of applied physics (07.09.2013)
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Journal Article
Resilience of ultra-thin oxynitride films to percolative wear-out and reliability implications for high-? stacks at low voltage stress
Raghavan, Nagarajan, Padovani, Andrea, Li, Xiang, Wu, Xing, Lip Lo, Vui, Bosman, Michel, Larcher, Luca, Leong Pey, Kin
Published in Journal of applied physics (01.01.2013)
Published in Journal of applied physics (01.01.2013)
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Journal Article
Impact of Gate Dielectric Breakdown Induced Microstructural Defects on Transistor Reliability
Li, Xiang, Pey, Kin Leong, Lo, Vui Lip, Ranjan, Rakesh, Tung, Chih Hang, Tang, Lei Jun
Published in ECS transactions (10.07.2009)
Published in ECS transactions (10.07.2009)
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Journal Article
Influence of Oxide Breakdown Percolation Resistance on MOSFETs (Invited Paper)
Pey, Kin Leong, Lo, Vui Lip, Tung, Chih Hang, Lim, Wai Tat, Ang, Diing Shenp
Published in ECS transactions (27.04.2007)
Published in ECS transactions (27.04.2007)
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Journal Article
Influence of Oxide Breakdown Percolation Resistance on MOSFETs (Invited Paper)
Pey, Kin Leong, Lo, Vui Lip, Tung, Chih Hang, Lim, Wai Tat, Ang, Diing Shenp
Published in Meeting abstracts (Electrochemical Society) (01.03.2007)
Published in Meeting abstracts (Electrochemical Society) (01.03.2007)
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Journal Article