A Flexible Thin-Film Inductor for High-Efficiency Wireless Power Transfer
Yao, Yuan, Qiu, Xing, Cheng, Yuanjie, LO, Jeffery C. C., Ricky Lee, S. W., Ki, Wing-Hung, Tsui, Chi-Ying
Published in IEEE electron device letters (01.03.2023)
Published in IEEE electron device letters (01.03.2023)
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Journal Article
Radiographic and Clinical Outcomes of the Treatment of Immature Permanent Teeth by Revascularization or Apexification: A Pilot Retrospective Cohort Study
Alobaid, Adel S., BDS, MSc, Cortes, Lina M., BDS, Lo, Jeffery, DDS, Nguyen, Thuan T., DDS, Albert, Jeffery, DDS, Abu-Melha, Abdulaziz S., BDS, MSc, Lin, Louis M., DMD, PhD, Gibbs, Jennifer L., MAS, DDS, PhD
Published in Journal of endodontics (01.08.2014)
Published in Journal of endodontics (01.08.2014)
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Journal Article
The Effect of Metallic Interconnect Spacing on the Thermal Resistance of Flip-Chip Light-Emitting Diodes With Underfill Encapsulation
Shang, Andrew W., Lo, Jeffery C. C., Lee, S. W. Ricky
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2019)
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Journal Article
A Novel Approach to Characterize Phosphor Particles for the Color Tuning of WLEDs
Jiaqi Wang, Lo, Jeffery C. C., Lee, S. W. Ricky, Mian Tao, Huayong Zou, Feng Yun
Published in IEEE photonics technology letters (15.03.2018)
Published in IEEE photonics technology letters (15.03.2018)
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Journal Article
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
Lau, John H., Li, Ming, Li, Qingqian Margie, Xu, Iris, Chen, Tony, Li, Zhang, Tan, Kim Hwee, Yong, Qing Xiang, Cheng, Zhong, Wee, Koh Sau, Beica, Rozalia, Ko, C. T., Lim, Sze Pei, Fan, Nelson, Kuah, Eric, Kai, Wu, Cheung, Yiu-Ming, Ng, Eric, Xi, Cao, Ran, Jiang, Yang, Henry, Chen, Y. H., Lee, N. C., Tao, Mian, Lo, Jeffery, Lee, Ricky
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2018)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2018)
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Journal Article
An Implantable Medical Device for Transcorneal Electrical Stimulation: Packaging Structure, Process Flow, and Toxicology Test
Fuliang Le, Lo, Jeffery C. C., Xing Qiu, Lee, Shi-Wei Ricky, Xing Li, Chi-Ying Tsui, Wing-Hung Ki
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2016)
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Journal Article
Proteomics based markers of clinical pain severity in juvenile idiopathic arthritis
Van Der Heijden, Hanne, Fatou, Benoit, Sibai, Diana, Hoyt, Kacie, Taylor, Maria, Cheung, Kin, Lemme, Jordan, Cay, Mariesa, Goodlett, Benjamin, Lo, Jeffery, Hazen, Melissa M, Halyabar, Olha, Meidan, Esra, Schreiber, Rudy, Jaimes, Camilo, Ecklund, Kirsten, Henderson, Lauren A, Chang, Margaret H, Nigrovic, Peter A, Sundel, Robert P, Steen, Hanno, Upadhyay, Jaymin
Published in Pediatric Rheumatology (15.01.2022)
Published in Pediatric Rheumatology (15.01.2022)
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Journal Article
Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing
Fuliang Le, Lee, Shi-Wei Ricky, Chaoran Yang, Lo, Jeffery C. C.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2015)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2015)
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Journal Article
Failure Analysis and Experimental Verification for Through-Silicon-via Underfill Dispensing on 3-D Chip Stack Package
Fuliang Le, Lee, Shi-Wei Ricky, Lo, Jeffery C. C., Chaoran Yang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2015)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2015)
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Journal Article
Solderability Analysis of Inkjet-printed Silver Pads with SAC Solder Joints
Jiang, Qian, Tu, Ning, Lo, Jeffery C. C., Ricky Lee, S. W.
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
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Conference Proceeding
Inkjet Printing High Resolution Polydimethylsiloxane Dots Array
Tu, Ning, Lo, Jeffery C. C., Ricky Lee, S. W.
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pads Printed by Aerosol Jet
Lo, Jeffery C. C., Jiang, Qian, Qiu, Xing, Tu, Ning, Lee, S. W. Ricky
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding