The reaction mechanism of cupric oxide reduction under hydrogen plasma treatment for epoxy molding compound / lead-frames adhesion improve
Min-Fong Shu, Bret Yang, Webber Liu, Yi-Hsiu Tseng
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
Lead-frames copper oxidation effect for a QFN package delamination improvement
Min-Fong Shu, Koduck Chen, Bret Yang, Liu, Webber, Yi-Hsiu Tseng
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding