Deformation assisted nucleation of continuous nanoprecipitates in Mg–Al alloys
Prameela, Suhas Eswarappa, Yi, Peng, Medeiros, Beatriz, Liu, Vance, Kecskes, Laszlo J., Falk, Michael L., Weihs, Timothy P.
Published in Materialia (01.03.2020)
Published in Materialia (01.03.2020)
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Journal Article
Effect of Second Phase Particle Size on the Recrystallized Microstructure of Mg–Al Alloys Following ECAE Processing
Eswarappa Prameela, Suhas, Yi, Peng, Liu, Vance, Medeiros, Beatriz, Kecskes, Laszlo J., Falk, Michael L., Weihs, Timothy P.
Published in Magnesium Technology 2020
Published in Magnesium Technology 2020
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Book Chapter
Comparative study of solder joint reliability assessment on fan-out CSP and flip-chip DCA package
Liu, Vance, Sinha, Koustav, Chen, Chia-Tien, Chen, Yi-Jing, Chen, Yi-Yu, Fan, Richard, Chen, Chien-Ming, Gan, Chong Leong
Published in Journal of materials science. Materials in electronics (01.11.2023)
Published in Journal of materials science. Materials in electronics (01.11.2023)
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Journal Article
Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application
Liu, Vance, Zou, Yung-Sheng, Chen, Yi-Yu, Chang, Wan Ling, Foo, Xue Qin, Chen, Yi-Jing, Chen, Chien-Ming, Chung, Min-Hua, Gan, Chong Leong
Published in Materials science in semiconductor processing (15.08.2024)
Published in Materials science in semiconductor processing (15.08.2024)
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Journal Article
The Shift-Left Die Strength Analysis Method for Memory Die Products
Liu, Vance, Wang, Yi-Chen, Tsai, Cyane, Chen, Jeremy, Leong Gan, Chong, Bansal, Raj, Takiar, Hem
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
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Conference Proceeding
Solder Joint Reliability Assessment on FO-CSP for Next Generation DDR6
Liu, Vance, Chen, Jian-Ming, Pan, Ji-An, Sinha, Koustav, Gan, CL, Yoo, Chan, Takiar, Hem
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Substrate Copper Trace Crack Characterization and Simulation
Yu, Wei, Che, Faxing, Liu, Vance, Lin, Milly, Lin, Jay, Rumsey, Brad, Glancey, Christopher, Ong, Yeow Chon, Ng, Hong Wan
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Comparative Study of Solder Strength Characterization for BGA Packages
Liu, Vance, Lai, Show, Zou, Mason, Chen, Jeremy, Gan, Cl, Takiar, Hem
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Creep Viscoplastic Characterization of SAC Solders Exposed to Different Isothermal Aging
Liu, Vance, Lin, Sih-Tung, Chang, Esan, Chen, Chien-Min, Gan, Chong Leong
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
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Conference Proceeding
Effects of Epoxy Molding Compound on managed NAND(mNAND) package strain enhancement
Chen, Joyce, Liu, Vance, Lin, Lewis, Chung, Min, Gan, Chong Leong, Takiar, Hem
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
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Conference Proceeding
Mechanical Suite of Flexural Bending Method for Electronic Memory Packages
Liu, Vance, Arifeen, Shams, Bassett, Cassie, Chung, Min, Gan, CL, Takiar, Hem
Published in 2021 IEEE International Conference on Sensors and Nanotechnology (SENNANO) (22.09.2021)
Published in 2021 IEEE International Conference on Sensors and Nanotechnology (SENNANO) (22.09.2021)
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Conference Proceeding