A Non-Destructive Testing Method for Fault Detection of Substation Grounding Grids
Wang, Xiujuan, Fu, Zhihong, Wang, Yao, Liu, Renkuan, Chen, Lin
Published in Sensors (Basel, Switzerland) (02.05.2019)
Published in Sensors (Basel, Switzerland) (02.05.2019)
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Journal Article
Overview of monitoring methods of press‐pack insulated gate bipolar transistor modules under different package failure modes
Liu, Renkuan, Li, Hui, Yao, Ran, Lai, Wei, Xiao, Wang, Tan, Hongtao
Published in IET power electronics (01.03.2023)
Published in IET power electronics (01.03.2023)
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Journal Article
Research on Long-term Reliability of Silver Sintered Press-Pack IGBT Modules
Liu, Renkuan, Li, Hui, Yao, Ran, Wang, Xiao, Tan, Hongtao, Lai, Wei, Yu, Yue, Zhu, Zheyan, Zhou, Bailing
Published in Power electronic devices and components (01.10.2022)
Published in Power electronic devices and components (01.10.2022)
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Journal Article
Experimental Studies for Shear and Multi-Impact Resistance Performance of Sand–Geofoam Material
Ge, Qi, Zuo, Wenhao, Liu, Renkuan, Zhu, Baoying, Zhao, Peng, Wan, Li, Wang, Yifan, Zhao, Rong
Published in Buildings (Basel) (10.05.2022)
Published in Buildings (Basel) (10.05.2022)
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Journal Article
Thermal Contact Resistance Optimization of Press-Pack IGBT Device Based on Liquid Metal Thermal Interface Material
Wang, Xiao, Li, Hui, Yao, Ran, Lai, Wei, Liu, Renkuan, Yu, Renze, Chen, Xianping, Li, Jinyuan
Published in IEEE transactions on power electronics (01.05.2022)
Published in IEEE transactions on power electronics (01.05.2022)
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Journal Article
A Thermal Twin Modeling Method of Press Pack IGBT Based on Power Loss
Li, Hui, Zhou, Bailing, Yao, Ran, Lai, Wei, Chen, Xianping, Liu, Renkuan, Chen, Zhongyuan, Wang, Miaorui
Published in IEEE transactions on electron devices (01.12.2022)
Published in IEEE transactions on electron devices (01.12.2022)
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Journal Article
Reactive-voltage coordinated control of offshore wind farm considering multiple optimization objectives
Tan, Hongtao, Li, Hui, Yao, Ran, Zhou, Zhiting, Liu, Renkuan, Wang, Xiao, Zheng, Jie
Published in International journal of electrical power & energy systems (01.03.2022)
Published in International journal of electrical power & energy systems (01.03.2022)
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Journal Article
Improving Short-Circuit Withstand Capability by Targeted Optimization Package for Press-Pack IGBT Module
Liu, Renkuan, Li, Hui, Luo, Xiaorong, Yao, Ran, Lai, Wei, Wei, Jie, Wang, Xiao, Li, Zhaoji, Zhang, Bo, Chen, Xianping
Published in IEEE transactions on power electronics (01.10.2024)
Published in IEEE transactions on power electronics (01.10.2024)
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Journal Article
Novel Integrated Double pMOS SOI-LIGBT With Low Loss and High Short-Circuit Capability
Wei, Jie, Lu, Jinlong, Dai, Kaiwei, Tan, Jialei, Liu, Renkuan, Zhu, Pengchen, Li, Hui, Zhang, Bo, Luo, Xiaorong
Published in IEEE transactions on electron devices (01.11.2024)
Published in IEEE transactions on electron devices (01.11.2024)
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Journal Article
An Improved Evaluation Method for the Short-Circuit Withstand Capability of Press-Pack IGBT Modules
Liu, Renkuan, Li, Hui, Yao, Ran, Chen, Siyu, Luo, Xiaorong, Lai, Wei, Chen, Xianping, Tan, Hongtao, Zhou, Bailing
Published in IEEE transactions on electron devices (01.01.2024)
Published in IEEE transactions on electron devices (01.01.2024)
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Journal Article
Investigation on Formation and Evolution Behavior of Short-circuit Path in Press-pack IGBT Modules
Liu, Renkuan, Li, Hui, Yao, Ran, Lai, Wei, Chen, Siyu, Chen, Xianping, Chen, Zhongyuan
Published in IEEE journal of emerging and selected topics in power electronics (2024)
Published in IEEE journal of emerging and selected topics in power electronics (2024)
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Journal Article
Optimization on Thermomechanical Behavior for Improving the Reliability of Press Pack IGBT Using Response Surface Method
Li, Hui, Yu, Renze, Yao, Ran, Wang, Xiao, Li, Jinyuan, Liu, Renkuan, Yu, Yue, Chen, Xianping
Published in IEEE journal of emerging and selected topics in power electronics (01.10.2021)
Published in IEEE journal of emerging and selected topics in power electronics (01.10.2021)
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Journal Article
Testing and Assessment on the Short-Circuit Withstand Capability of Press-Pack IGBT Considering the Unbalanced Clamping Forces
Liu, Renkuan, Li, Hui, Yao, Ran, Chen, Siyu, Lai, Wei, Chen, Xianping, Wang, Xiao, Tan, Hongtao, Li, Jinyuan, Qu, Haitao
Published in IEEE journal of emerging and selected topics in power electronics (01.02.2023)
Published in IEEE journal of emerging and selected topics in power electronics (01.02.2023)
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Journal Article