Reliability of high Tg copper clad laminate for lead-free assembly
Ado Liu, Jeng-I Chen
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
Dk/Df variation in different phosphorus contained- and Bromide contained-laminate during moisture absorption
Chun Chieh Huang, Li Chun Chen, Liu, Ado, Meng Song Yin
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
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Conference Proceeding