Bump deposition techniques for hybrid X-ray detectors
Schneider, Andreas, Ghorbanian, Navid, Osborn, Jack, Cross, Simon P., Lipp, John D., French, Marcus J.
Published in Journal of instrumentation (01.06.2023)
Published in Journal of instrumentation (01.06.2023)
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Journal Article
Deposition of Fine-Pitch Indium Bumps on Single Die
Schneider, Andreas, Ghorbanian, Navid, Burt, David, Hollingham, James, Booker, Paul, Brooks, Toby G., Lipp, John D., French, Marcus J.
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
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Conference Proceeding
Thin Si Sensors on Flexible Printed Circuits - Study of Two Bond Methods
Schneider, Andreas, Beckett, Dan, Hill, Andrew, Borri, Marcello, Lemmon, Roy, Lipp, John D., Chartier, Marielle
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
A Study on Fine-Pitch Convertors for Radiation Detectors with Interposers as an Alternative to Through Silicon Via Technology
Schneider, Andreas, Beckett, Dan, Ghorbanian, Navid, Cross, Simon P., Veale, Mathew C., Wilson, Mathew D., Hart, Mathew, Lipp, John D., French, Marcus J.
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding
Stencil Printing and Flip-Chip Bonding for Assembly of Pixelated X-ray Detectors using PCB-type Interposer and Flexible Printed Circuit Boards
Schneider, Andreas, Cross, Simon P., Wilson, Matthew D., Veale, Matthew C., Hart, Matthew, Seller, Paul, Borri, Marcello, Beckett, Dan, Lipp, John D.
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)
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Conference Proceeding
Single Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-Tall Indium Bumps Across an Entire Chip
Schneider, Andreas, Koorikkat, Aswathi, Burt, David, Ghorbanian, Navid, Brookes, Toby G., Lipp, John D., French, Marcus J.
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11.09.2024)
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11.09.2024)
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Conference Proceeding
Single-Electron Response Using a GEM-MIGAS Electron Multiplier
Mir, J.A., Maia, J.M., Conceicao, A.S., Stephenson, R., Lipp, J.D., Rhodes, N.J., Schooneveld, E.M., da Luz, H.N., Veloso, J., dos Santos, J.
Published in IEEE transactions on nuclear science (01.08.2008)
Published in IEEE transactions on nuclear science (01.08.2008)
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Journal Article
A programmable analogue front-end ASIC for gas micro-strip detectors having a wide range of input capacitance
Khalid, F.F., Jones, L.L., Prydderch, M.L., Morrissey, Q., Lipp, J.D., Stephenson, R.
Published in 2009 IEEE Nuclear Science Symposium Conference Record (NSS/MIC) (01.10.2009)
Published in 2009 IEEE Nuclear Science Symposium Conference Record (NSS/MIC) (01.10.2009)
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Conference Proceeding
A Programmable Analogue Front-End ASIC for Gas Micro-Strip Detectors having a wide range of Input Capacitance
Khalid, F.F., Jones, L.L., Stephenson, R., Lipp, J.D.
Published in 2006 IEEE Nuclear Science Symposium Conference Record (01.10.2006)
Published in 2006 IEEE Nuclear Science Symposium Conference Record (01.10.2006)
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Conference Proceeding
In Situ Investigations into Chemical Processes by Electron-Energy-Resolved X-Ray Absorption Spectroscopy
Vollmer, Antje, Lipp, John D., Weiss, Helmut, O'Malley, Rachel, Rayment, Trevor
Published in Angewandte Chemie (12.07.2004)
Published in Angewandte Chemie (12.07.2004)
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Journal Article